公开(公告)号：WO2006012529A1

公开(公告)日：2006-02-02

申请号：PCT/US2005/026075

申请日：2005-07-22

Applicant: TERADYNE, INC. ,  GAILUS, Mark, W. ,  CARTIER, Marc, B., Jr.

Inventor： GAILUS, Mark, W. ,  CARTIER, Marc, B., Jr.

IPC: G01R35/00

CPC classification number: G01R35/007 ,  H05K1/0268 ,  H05K1/0298 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09981

Abstract: Calibration standards for accurate high frequency or wide bandwidth calibration measurements. A "short" or "reflect" standard is formed in a printed circuit board from a conductive coating on a generally planar surface. The conductive coating connects a signal trace to one or more ground planes. The generally planar surface is at least as wide as the signal trace and is preferably several times wider than the signal trace to provide a short standard with properties uniform over a wide frequency range. The short standard is incorporated into a printed circuit upon which a device under test is to be mounted. Connections to the short standard are made through components equivalent to components used to connect a device under test. When a through and line standard are added to the same board, the test board contains all the standards needed for a TRL calibration.

Abstract translation: 精确的高频或宽带宽校准测量的校准标准。 在大体上平坦的表面上由导电涂层形成印刷电路板中的“短”或“反射”标准。 导电涂层将信号迹线连接到一个或多个接地层。 通常平面的表面至少与信号迹线一样宽，并且优选地比信号迹线宽数倍，以提供具有在宽频率范围内均匀的特性的短标准。 短标准被并入印刷电路中，在该印刷电路中将安装被测器件。 与短标准的连接通过与用于连接被测设备的组件相当的组件进行。 当通过和线路标准被添加到同一个板上时，测试板包含TRL校准所需的所有标准。

公开(公告)号：WO2006039277A1

公开(公告)日：2006-04-13

申请号：PCT/US2005/034605

申请日：2005-09-28

Applicant: TERADYNE, INC. ,  GAILUS, Mark, W.

Inventor： GAILUS, Mark, W.

IPC: H01R12/16 ,  H01R13/719 ,  H05K1/02

CPC classification number: H01R13/6471 ,  H01R12/721 ,  H01R13/46 ,  H01R13/514 ,  H01R13/6476 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6599 ,  H01R13/719 ,  H01R23/688 ,  H01R43/16 ,  H05K1/0233 ,  Y10T29/49204

Abstract: An electrical connector with electrically lossy materials bridging ground members. The lossy conductive members may be formed by filling a settable binder with conductive particles, allowing the partially conductive members to be formed through an insert molding process. Connectors assembled from wafers that contain signal conductors held within an insulative housing may incorporate lossy conductive members by having filled thermal plastic molded onto the insulatative housing. The lossy conductive members may be used in conjunction with magnetically lossy materials. The lossy conductive members reduce ground system do resonance within the connector, thereby increasing the high frequency performance of the connector.

Abstract translation: 具有桥接接地构件的电耗损材料的电连接器。 可以通过用导电颗粒填充可固化的粘合剂来形成有损的导电构件，从而允许通过嵌入成型工艺形成部分导电构件。 由包含固定在绝缘壳体内的信号导体的晶片组装的连接器可以通过将填充的热塑性塑料模制到绝缘外壳上而引入有损耗的导电构件。 有损耗的导电构件可以与磁性损耗材料结合使用。 有损导电部件减少接地系统在连接器内进行共振，从而增加连接器的高频性能。

公开(公告)号：WO2007064672A2

公开(公告)日：2007-06-07

申请号：PCT/US2006/045621

申请日：2006-11-29

Applicant: AMPHENOL CORPORATION ,  GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

Inventor： GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

IPC: H05K7/00

CPC classification number: H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb) - free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. The further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

Abstract translation: 用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，该导电粘合剂可以是无铅（Pb）。 接触尾部被压印，提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头，将粘合剂保持在铅附近，以保持更牢固的接头。 此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。 在粘合剂的转移方面的进一步的帮助下，接触尾部可以形成有凹部，这增加了粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

公开(公告)号：WO2008094135A3

公开(公告)日：2008-08-07

申请号：PCT/US2006/045624

申请日：2006-11-29

Applicant: AMPHENOL CORPORATION ,  GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

Inventor： GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

IPC: H01R12/00

Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

公开(公告)号：WO2011106572A2

公开(公告)日：2011-09-01

申请号：PCT/US2011/026139

申请日：2011-02-24

Applicant: AMPHENOL CORPORATION ,  GAILUS, Mark, W. ,  ATKINSON, Prescott ,  HANRAHAN, Mark, G.

Inventor： GAILUS, Mark, W. ,  ATKINSON, Prescott ,  HANRAHAN, Mark, G.

IPC: H01R13/658 ,  H01R24/30

CPC classification number: H01R13/6474 ,  H01R12/724 ,  H01R12/737 ,  H01R13/514 ,  H01R13/6477 ,  H01R13/6598

Abstract: An improved open pin field connector is provided for enhanced performance when carrying high speed signals by selective application of one or more techniques for controlling electrical performance parameters. Lossy material may be positioned adjacent to conductive elements of the connector so as to reduce resonance in pairs of conductive elements and/or to provide a desired characteristic impedance for pairs of differential signal conductors. The lossy material may be shaped and positioned to avoid capacitive coupling that might otherwise increase cross talk. In a right angle connector, the lossy material may have a step-wise increase in thickness to provide comparable loss along longer and shorter conductive elements. Conductive elements may be shaped to balance performance characteristics of pairs selected to carry differential signals regardless of orientation along a row or column. Alternatively, conductive elements may have narrowed regions, covered with lossy portions, for reducing resonance while supporting DC signal propagation.

Abstract translation: 提供了一种改进的开口引脚现场连接器，用于通过选择性地应用一种或多种用于控制电性能参数的技术来承载高速信号时提高性能。 有损材料可以被定位成与连接器的导电元件相邻，以便减少成对的导电元件的谐振和/或为差分信号导体对提供期望的特性阻抗。 有损耗材料可以被成形和定位以避免电容耦合，否则可能会增加串扰。 在直角连接器中，有损耗的材料可以具有逐步增加的厚度，以便沿较长和较短导电元件提供相当的损耗。 导电元件可以被成形为平衡被选择用于承载差分信号的对的性能特性，而不管沿着行或列的取向。 或者，导电元件可以具有用有损部分覆盖的变窄的区域，用于在支持DC信号传播的同时减少谐振。

公开(公告)号：WO2010056312A2

公开(公告)日：2010-05-20

申请号：PCT/US2009/006058

申请日：2009-11-12

Applicant: AMPHENOL CORPORATION ,  ATKINSON, Prescott ,  GAILUS, Mark, W.

Inventor： ATKINSON, Prescott ,  GAILUS, Mark, W.

IPC: H01R12/16 ,  H01R13/514 ,  H01R13/646

CPC classification number: H01R13/719

Abstract: An improved power connector provides improved signal integrity in an interconnection system. The connector includes a filter element between a supply contact and a return contact. The filter element may be primarily capacitive, but may also include a resistance and a ferrite member. For connectors that include multiple sets of supply and return contacts, a single filter element may be included, or multiple filter elements may be included between multiple pairs of power and return contacts. The filter element may be formed within a connector housing or otherwise incorporated when the connector is manufactured. Alternatively, the filter element may be inserted into a receptacle such that filtering may be selectively incorporated as the connectors are used. When connected to a conducting loop for carrying power supply, the filter element provides substantially zero attenuation at frequencies below about 50 MHz and in excess of 10 dB of attenuation over a range that extends above 500 MHz.

Abstract translation: 改进的电源连接器在互连系统中提供改进的信号完整性。 连接器包括供电触点和返回触点之间的滤波器元件。 滤波器元件可以主要是电容式的，但也可以包括电阻和铁氧体部件。 对于包括多组电源和返回触点的连接器，可能包含一个滤波器元件，或者多对电源和返回触点之间可能包含多个滤波器元件。 过滤器元件可以形成在连接器壳体内，或者在制造连接器时以其他方式结合。 或者，过滤器元件可以插入容器中，使得当使用连接器时可以选择性地结合过滤。 当连接到用于传输电源的导电回路时，滤波器元件在低于约50MHz的频率处提供基本上为零的衰减，并且在高于500MHz的范围上提供超过10dB的衰减。

公开(公告)号：WO2012094347A2

公开(公告)日：2012-07-12

申请号：PCT/US2012/020113

申请日：2012-01-03

Applicant: AMPHENOL CORPORATION ,  GAILUS, Mark, W. ,  ELLSWORTH, Stephen, W. ,  ATKINSON, Prescott, B.

Inventor： GAILUS, Mark, W. ,  ELLSWORTH, Stephen, W. ,  ATKINSON, Prescott, B.

IPC: H01R24/58 ,  H01R12/71

CPC classification number: H01R13/6633 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0243 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A network interface adapted for high speed networks. The interface includes isolation circuits with a transformer containing two primary coils and two secondary coils. A wire making up each primary coil may be twisted with a wire making up a secondary. These two coils may then be co-wound on a common core. The transformer may be connected to a common mode choke. The isolation circuit may be packaged such that the transformer and coil are in a line, with isolation circuits for a plurality of pairs arranged in parallel. The interface circuit may be packaged in a connector housing, which also may be adapted for high speed performance. The housing may receive multiple isolation circuits in parallel. The housing may also include a mating contact portion in which mating contacts for signal conductors of each pair are positioned along the same side of a cavity.

Abstract translation:

适用于高速网络的网络接口。 该接口包括具有包含两个初级线圈和两个次级线圈的变压器的隔离电路。 构成每个初级线圈的电线可以与构成次级的电线绞合。 这两个线圈然后可以共同缠绕在一个共同的核心上。 变压器可能连接到共模扼流圈。 隔离电路可以被封装，使得变压器和线圈处于一条线路中，并且具有用于并联布置的多对线路的隔离电路。 接口电路可以封装在连接器外壳中，该连接器外壳也可以适用于高速性能。 外壳可以并行接收多个隔离电路。 壳体还可以包括配合接触部分，其中每对信号导体的配合触点沿着空腔的同一侧定位。

公开(公告)号：WO2011056842A1

公开(公告)日：2011-05-12

申请号：PCT/US2010/055250

申请日：2010-11-03

Applicant: AMPHENOL CORPORATION ,  GIRARD, Donald, A. ,  GAILUS, Mark, W. ,  STOKOE, Philip, T.

Inventor： GIRARD, Donald, A. ,  GAILUS, Mark, W. ,  STOKOE, Philip, T.

IPC: H01R12/71 ,  H01R13/648

CPC classification number: H01R13/6466 ,  H01R13/6587 ,  H05K3/34 ,  Y10T29/49144

Abstract: An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation.

Abstract translation: 具有集成到电连接器的印刷电路板占位面积的电容器的互连系统。 每个电容器的一端在印刷电路板上与连接器中的导电元件的接触尾部共享焊盘。 共享焊盘不通过过孔连接到内部电路结构。 相反，通常形成为连接器安装垫的一部分的通孔形成为单独的相邻垫的一部分。 电容器的第二端附接到相邻的焊盘，通过电容器在导电元件和通孔之间形成电连接。 将电容器集成到占位面积中减少了所需的通孔数量，从而提高了信号完整性。 电容器可以与连接器分开地放置在印刷电路板上，或者可以并入到连接器中，从而允许将连接器和电容器放置在一个操作中。

公开(公告)号：WO1996038889A1

公开(公告)日：1996-12-05

申请号：PCT/US1996003071

申请日：1996-03-04

Applicant: TERADYNE, INC.

Inventor： TERADYNE, INC. ,  COHEN, Thomas, S. ,  GAILUS, Mark, W.

IPC: H01R23/68

CPC classification number: H01R13/502 ,  H01R12/714 ,  H01R12/721 ,  H01R12/725 ,  H01R13/405 ,  H01R13/6585

Abstract: A high speed, high density surface mount connector which may be easily manufactured. The connector is formed by injection molding a ground plate into a portion of an insulative housing, leaving conducting beam portions and tail portions extending from opposite ends of the housing. A mating section of the housing is separately made. Signal contacts are sandwiched between the two pieces of the housing, which are then mated. The signal contacts are parallel to the ground plate but spaced apart from it, forming individual transmission lines. In use, the tail portions are soldered to a printed circuit board. The beam portions are bent to form contact springs. They make contact to a back plane when the connector is pressed against the back plane.

Abstract translation: 可以容易地制造的高速，高密度表面贴装连接器。 连接器通过将接地板注塑成绝缘壳体的一部分而形成，从而导电梁部分和尾部从壳体的相对端延伸。 壳体的配合部分分开制造。 信号触点夹在两块外壳之间，然后将其接合。 信号触点平行于接地板，但与其隔开，形成各个传输线。 在使用中，尾部被焊接到印刷电路板。 梁部分被弯曲以形成接触弹簧。 当连接器压靠背板时，它们与背板接触。

公开(公告)号：WO2003003799A1

公开(公告)日：2003-01-09

申请号：PCT/US2002/019961

申请日：2002-06-24

Applicant: TERADYNE, INC.

Inventor： GAILUS, Mark, W.

IPC: H05K3/32

CPC classification number: H01R12/523 ,  H01R12/585 ,  H01R13/658 ,  H05K3/308 ,  H05K3/325 ,  H05K3/4069

Abstract: A multi-layer printed circuit board (30) includes a non-conductive via (54) which intersects a conductive trace (44) on an inner layer (38) of the board and is adapted to receive a conductive element (60) configured to make direct contact with the conductive trace (44). The non-conductive via (54) may extend through all or only a portion of the multi-layer board (30). Illustrative conductive elements (60) include a press fit contact, such as an eye-of-the-needle contact of an electrical component, a wedge-shaped contact, and a conductive polymer stripe. Also described is a stepped non-conductive via (160) having a reduced diameter portion (160a) intersecting an inner layer conductor (162) and a larger diameter portion (160b). The stepped via is adapted to receive a conductive element (166) having a reduced diameter portion (166a) in contact with the conductor and a larger diameter portion (166b) press-fit into the larger diameter (160b) portion to mechanically secure the conductive element (166) to the board.

Abstract translation: 多层印刷电路板（30）包括非导电通孔（54），其与板的内层（38）上的导电迹线（44）相交，并且适于接收导电元件（60），导电元件 与导电迹线（44）直接接触。 非导电通孔（54）可以延伸穿过多层板（30）的全部或仅一部分。 说明性导电元件（60）包括压配合接触件，例如电部件，楔形接触件和导电聚合物条纹的针眼接触。 还描述了具有与内层导体（162）和较大直径部分（160b）相交的直径减小部分（160a）的阶梯式非导电通孔（160）。 台阶通孔适于接收具有与导体接触的直径减小部分（166a）的导电元件（166），并且较大直径部分（166b）压配合到较大直径（160b）部分中以机械地固定导电 元件（166）。