公开(公告)号：WO2014134507A2

公开(公告)日：2014-09-04

申请号：PCT/US2014/019544

申请日：2014-02-28

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： LINDLEY, Jacob, R.

IPC: H05B3/14

CPC classification number: H01L21/683 ,  C23C16/4581 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/68742 ,  H01L21/68785 ,  H01L21/68792 ,  H05B3/143 ,  H05B3/26 ,  H05B3/265 ,  H05B2203/002 ,  H05B2203/013 ,  H05B2203/017 ,  Y10T29/49002 ,  Y10T29/53178

Abstract: A support assembly for use in semiconductor processing includes an application substrate, a heater layer disposed directly onto the application substrate, an insulation layer disposed onto the heater layer, and a second substrate disposed onto the insulation layer. The heater layer is directly disposed onto the application substrate by a layered process such that the heater layer is in direct contact with the application substrate. The application substrate defines a material having a relatively low coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the heater layer.

Abstract translation: 用于半导体处理的支撑组件包括施加衬底，直接设置在应用衬底上的加热器层，设置在加热器层上的绝缘层和设置在绝缘层上的第二衬底。 加热器层通过分层工艺直接设置在施加衬底上，使得加热器层与施加衬底直接接触。 应用衬底限定了具有与加热器层的热膨胀系数匹配的相对低的热膨胀系数的材料。

公开(公告)号：WO2022140526A1

公开(公告)日：2022-06-30

申请号：PCT/US2021/064829

申请日：2021-12-22

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： LINDLEY, Jacob, R. ,  EVERLY, Mark, D. ,  JONES, Michael, A. ,  LONG, Dennis, P. ,  BOEHMER, Scott, H. ,  SCHMIDT, Philip, S.

IPC: H05B3/06 ,  F24H1/10 ,  H05B3/42

Abstract: A termination assembly for a heater assembly includes a plurality of resistive heaters (26) arranged in discrete power phases, each resistive heater comprising a resistive heating element surrounded by dielectric material and a sheath. The termination assembly includes a plurality of electrically nonconductive members (76). Each electrically nonconductive member (76) includes a plurality of apertures configured to receive power pins (80) of the plurality of resistive heaters. The termination assembly includes a plurality of connectors (82) configured to connect the power pins to the electrically nonconductive members. Each electrically nonconductive member includes a number of the plurality of connectors corresponding to a number of power pins being terminated. The termination assembly includes an electrical circuit (85) embedded in or disposed on at least one of the plurality of electrically nonconductive members.

公开(公告)号：WO2010080883A1

公开(公告)日：2010-07-15

申请号：PCT/US2010/020330

申请日：2010-01-07

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY ,  ELLIS, Eric ,  BOLTON, Troy, Ruben ,  LINDLEY, Jacob, R.

Inventor： ELLIS, Eric ,  BOLTON, Troy, Ruben ,  LINDLEY, Jacob, R.

IPC: H05B3/56

CPC classification number: H05B3/58 ,  F16L53/38 ,  H05B3/50 ,  H05B2214/03

Abstract: A heater system is provided that includes a hybrid insulation cover that has a first cover disposed around hinged carrier members and heat trace sections, and a second cover operatively engaged with the first cover and adapted for detachable placement around a heating target and its varying geometries. A flexible insulation jacket having a similar construction as the second cover is also provided for use with connector assemblies. Furthermore, a heater system is provided that includes at least one heat trace section encapsulated within adjacent insulating members for use with heating gaslines and pumplines of semiconductor processing systems.

Abstract translation: 提供了一种加热器系统，其包括混合绝缘盖，该混合绝缘盖具有围绕铰接的承载构件和热迹线部分设置的第一盖，以及与第一盖可操作地接合并适于围绕加热目标及其变化几何形状的可拆卸放置的第二盖。 具有与第二盖相似结构的柔性绝缘护套也被提供用于连接器组件。 此外，提供了一种加热器系统，其包括封装在相邻绝缘构件内的至少一个热迹线段，用于加热半导体处理系统的气体线路和泵浦线路。

公开(公告)号：WO2014008241A1

公开(公告)日：2014-01-09

申请号：PCT/US2013/049038

申请日：2013-07-02

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： LINDLEY, Jacob, R. ,  MEYER, Dean, J. ,  GLEW, Alexander, D.

IPC: H01L21/67 ,  H05B3/14 ,  H05B3/28

CPC classification number: H01L21/67103 ,  H01C17/06 ,  H01L21/6831 ,  H02N13/00 ,  H05B3/0014 ,  H05B3/06 ,  H05B3/12 ,  H05B3/14 ,  H05B3/28 ,  H05B2203/017 ,  Y10T29/49083

Abstract: A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater to the heater substrate after the heater substrate is secured to the application substrate. The application of the layered heater includes applying a first dielectric layer onto the heater substrate, applying a resistive heating layer onto the first dielectric layer, and applying a second dielectric layer onto the resistive heating layer. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of at least one of the first dielectric layer and a coefficient of thermal expansion of the resistive heating layer.

Abstract translation: 形成用于半导体处理的加热器组件的方法包括将加热器基板热固定到应用基板; 以及在所述加热器基板固定到所述应用基板之后，将层状加热器施加到所述加热器基板。 层状加热器的应用包括将第一介电层施加到加热器基板上，在第一介电层上施加电阻加热层，以及在电阻加热层上施加第二电介质层。 加热器基板限定具有与第一介电层中的至少一个的热膨胀系数和电阻加热层的热膨胀系数相匹配的热膨胀系数的材料。