Abstract:
A transmitter circuit for generating a modulated signal in a transmitter of an integrated circuit is described. The transmitter circuit comprises a multiplexing stage (302) having a multiplexing circuit (305) configured to receive a differential input signal and to generate a differential output signal at a first output node (310) of a first current path and at a second output node (311) of a second current path, the multiplexing stage having a gain circuit configured to increase the swing of the differential output signal generated at the first output node and the second output node. A method of generating a modulated signal in a transmitter of an integrated circuit is also disclosed.
Abstract:
An embodiment of a multichip module (200) is described. In this embodiment, the multichip module (200) includes a semiconductor die (201 ), an interposer (210) that is coupled to the semiconductor die (201 ), and a first inductor (512), where the interposer (210) includes the first inductor (512). This embodiment of the multichip module (200) further includes a second inductor (61 1 ) that is coupled in series to the first inductor (512), and a capacitor (601 ) that is coupled in parallel to the first inductor (512) and the second inductor (61 1 ).
Abstract:
A transmitter circuit for generating a modulated signal in a transmitter of an integrated circuit is described. The transmitter circuit comprises a multiplexing stage (302) having a multiplexing circuit (305) configured to receive a differential input signal and to generate a differential output signal at a first output node (310) of a first current path and at a second output node (311) of a second current path, the multiplexing stage having a gain circuit configured to increase the swing of the differential output signal generated at the first output node and the second output node. A method of generating a modulated signal in a transmitter of an integrated circuit is also disclosed.
Abstract:
A circuit for implementing a gain stage in an integrated circuit is described. The circuit comprises a first inductor (206) formed in a first plurality of metal layers (402-408); a second inductor (212) formed in a second plurality of metal layers (410-416), the second inductor coupled to a center tap (244) of the first inductor; and wherein the second inductor has a diameter that is less than a diameter of the first inductor. A method of implementing a gain stage in an integrated circuit is also described.
Abstract:
Various example implementations are directed to circuits and methods for inter-die communication on a multi-die integrated circuit (IC) package. According to an example implementation, an IC package (200, 400) includes a first semiconductor die (208, 400) having a plurality of communication circuits for communicating data over respective data terminals (218) of the package. The package also includes a second semiconductor die (102, 410) having N contacts (140, 206) for communicating data to and from the semiconductor die. The second semiconductor die (102, 410) includes a programmable logic circuit (1 10, 412) configured to communicate M parallel data signals with one or more other semiconductor dies of the package, wherein M>N. The second semiconductor die also includes a plurality of serializer circuits (130, 414), each configured to serialize data from a respective subset of the plurality of the M signal lines (120, 416) to produce serialized data and provide the serialized data to a respective one of the contacts (140, 206).
Abstract:
A driver circuit of an integrated circuit is described. The driver circuit comprises a signal node (122) coupled to receive an output signal of the integrated circuit; an inductor circuit (106) having a resistor (1 6) coupled in series with an inductor (118) between a first terminal and a second terminal, wherein the first terminal is coupled to the signal node; an electro-static discharge protection circuit (130) coupled to the second terminal of the inductor circuit; and an output node (104) coupled to the second terminal of the inductor circuit. A method of generating an output signal is also disclosed.
Abstract:
A symmetrical inductor includes pairs of half-loops (e.g., 312, 314, 316, 318), first and second terminal electrodes (e.g., 302, 304), and a center-tap electrode (e.g., 310). The half-loop pairs are in respective conductive layers (e.g., 101, 201 ) of an integrated circuit. Each half-loop pair includes a first (e.g., 312, 316) and second half-loop (e.g., 314, 318) in the respective conductive layer. The first and second terminal electrodes are in a first conductive layer, and the center-tap electrode is in a second conductive layer. The first terminal electrode and the center-tap electrode are coupled through a first series combination that includes the first half-loop of each half-loop pair. The second terminal electrode and the center-tap electrode are coupled through a second series combination that includes the second half-loop of each half-loop pair.
Abstract:
The dual inductor structure (100) can include a first inductor (110) including a first plurality of coils (205-220). Each coil of the first plurality of coils can be disposed within a different one of a plurality of conductive layers (105, 255-260). The coils of the first plurality of coils can be vertically stacked and concentric to a vertical axis. The dual inductor structure further can include a second inductor (115) including a second plurality of coils (405-420). Each of the second plurality of coils can be disposed within a different one of the plurality of conductive layers. The coils of the second plurality of coils can be vertically stacked and concentric to the vertical axis. Within each conductive layer, a coil of the second plurality of coils can be disposed within an inner perimeter of a coil of the first plurality of coils.
Abstract:
A circuit for generating a modulated signal in a transmitter of an integrated circuit is disclosed. The circuit comprises a transmitter driver circuit (302) having a first current path (325) for receiving a first input signal (Dataln) of a pair of differential input signals and a second current path (329) for receiving a second input signal (Dataln_b) of the pair of differential input signals, the transmitter driver circuit comprising a tail current path (327) coupled to each of the first current path and the second current path; a first current source (370) coupled between a first reference voltage (AVCCAUX) and ground (AVSS), wherein a first current of the first current source is proportional to the tail current of the tail current path; a first pull-up current source (460) coupled between the first reference voltage and a first output node (314) of the transmitter driver circuit; and a second pull-up current source (480) coupled between the first reference voltage and a second output node (320) of the transmitter driver circuit. A method of generating a modulated signal in a transmitter of an integrated circuit is also disclosed.
Abstract:
An inductor in an integrated circuit structure (302) can include a first through silicon via (TSV) (305) comprising a first end (335) and a second end; a second TSV (310) comprising a first end and a second end; a first bottom (340) formed of a first conductive material configured to couple the second end of the first TSV with the second end of the second TSV; a third TSV (315) comprising a first end and a second end; and a top (350) formed of a second conductive material and configured to couple the first end of the second TSV with the first end of the third TSV. The first bottom and the top are located on opposing sides (375, 370) of the integrated circuit structure.