公开(公告)号：WO2008112947A1

公开(公告)日：2008-09-18

申请号：PCT/US2008/056936

申请日：2008-03-14

申请人： FOOD SAFETY TECHNOLOGY, LLC ,  LYNN, Daniel W.

发明人： LYNN, Daniel W.

IPC分类号： C01B13/10

CPC分类号： C11D3/3947 ,  B01F3/04475 ,  B01F3/04503 ,  B01F3/04985 ,  B01F5/0068 ,  B01F5/0415 ,  B01F13/065 ,  B01F2003/04886 ,  B01F2215/0468 ,  B08B2203/005 ,  C01B13/10 ,  C02F1/78 ,  C11D11/0041

摘要： An industrial cleaning system 10 that produces and distributes an aqueous ozone solution is described. The system 10 includes an ozone generator 240 for generating ozone gas, which is injected by an injector 310 into a supply of water to form the aqueous ozone solution. A reaction vessel 350 receives the aqueous ozone solution from the injector 310 as the reaction vessel 350 reduces the bubbles of ozone gas in the aqueous ozone solution to increase the oxidation reduction potential of the aqueous ozone solution. The reaction vessel 350 includes a conical-shaped surface 385 having two or more edges 380 or ridges 382. The conical-shaped surface 385 defines a generally hollow interior 388. An inlet port 355 is in fluidic communication with a supply of an aqueous ozone solution to supply the aqueous ozone solution to the conical-shaped surface 380. Nozzles 360 direct water under pressure at the conical-shaped surface 380, and the water mixes with the aqueous ozone solution from the inlet port 355. An outlet 390 is in fluidic communication with the industrial cleaning system 10. A method of making an aqueous ozone solution is described. The reaction vessel 350 is in fluidic communication with a supply of a first aqueous ozone solution. The first aqueous ozone solution is directed to the reaction vessel 350. Water is directed to the reaction vessel 350, and the water and the first aqueous ozone solution are mixed to form a second aqueous ozone solution. Compositions for aqueous ozone solutions are also described. The aqueous ozone solution contains approximately 1 part by volume water mixed with approximately 4 parts by volume to approximately 9 parts by volume of the first aqueous ozone solution to form the second aqueous ozone solution that has an oxidation reaction potential of up to approximately 2.6 and having an ozone concentration of up to approximately 20 ppm.

摘要翻译： 描述了产生和分布臭氧水溶液的工业清洁系统10。 系统10包括用于产生臭氧气体的臭氧发生器240，臭氧发生器240由注射器310注入水源以形成臭氧水溶液。 当反应容器350减少臭氧水溶液中的臭氧气泡时，反应容器350接收来自注射器310的臭氧水溶液，以提高臭氧水溶液的氧化还原电位。 反应容器350包括具有两个或多个边缘380或脊382的圆锥形表面385.圆锥形表面385限定大致中空的内部388.入口端口355与臭氧溶液水溶液流体连通 将臭氧水溶液供应到锥形表面380.喷嘴360在锥形表面380处引导压力下的水，并且水与来自入口355的臭氧溶液混合。出口390处于流体连通 与工业清洁系统10一起描述制备臭氧水溶液的方法。 反应容器350与第一含水臭氧溶液的流体连通。 将第一臭氧水溶液引导至反应容器350.将水引导至反应容器350，并将水和第一臭氧水溶液混合以形成第二臭氧水溶液。 还描述了臭氧水溶液的组合物。 臭氧水溶液含有约1体积份的水，其混合约4体积份至约9体积份的第一臭氧水溶液，以形成氧化反应电位高达约2.6的第二臭氧水溶液，并具有 臭氧浓度高达约20ppm。

公开(公告)号：WO2007038263A2

公开(公告)日：2007-04-05

申请号：PCT/US2006036971

申请日：2006-09-22

申请人： APPLIED MATERIALS INC

发明人： WILLING BRUCE ,  FORSTER DANIEL P ,  HUO DAVID D ,  TOLLES ROBERT D ,  HAYNES CHRISTOPHER L ,  MEAR STEVE T ,  PAUL DAVID ,  EVANS WILLIAM M

IPC分类号： H01L21/306 ,  H01L21/00

CPC分类号： B08B3/04 ,  B08B3/08 ,  B08B2203/005 ,  C02F1/78 ,  C02F9/005 ,  C02F2103/02 ,  C02F2201/782 ,  C11D11/0047 ,  G03F7/423 ,  H01L21/6704

摘要： In a first aspect, an apparatus adapted to clean a semiconductor device manufacturing component is provided. The apparatus includes an ozone module adapted to (1) obtain Ozone; (2) combine the Ozone with a fluid to generate ozonated fluid; and (3) deliver the ozonated fluid to the semiconductor device manufacturing component so as to clean the semiconductor device manufacturing component . Numerous other aspects are provided.

摘要翻译： 在第一方面，提供一种适于清洁半导体器件制造部件的装置。 该装置包括适于（1）获得臭氧的臭氧模块; （2）将臭氧与流体混合以产生臭氧化流体; 和（3）将臭氧化流体输送到半导体器件制造部件以清洁半导体器件制造部件。 提供了许多其他方面。

公开(公告)号：WO2004066359A3

公开(公告)日：2004-12-09

申请号：PCT/US2004001792

申请日：2004-01-22

申请人： NOVO RES INC

发明人： KIM YONG BAE ,  JEONG IN KWON ,  KIM JUNGYUP

IPC分类号： B08B3/00 ,  B08B3/02 ,  B08B3/08 ,  B08B3/12 ,  B08B7/04 ,  H01L20060101 ,  H01L21/00 ,  H01L21/302 ,  H01L21/306 ,  H01L21/31 ,  H01L21/316 ,  H01L21/461 ,  H01L21/469

CPC分类号： H01L21/02046 ,  B08B3/02 ,  B08B3/08 ,  B08B2203/005 ,  H01L21/02238 ,  H01L21/31662 ,  H01L21/67051

摘要： An apparatus and method for treating surfaces of semiconductor wafers with a reactive gas, such as ozone, utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of processing fluid formed on a semiconductor wafer surface to increase the amount of reactive gas that reaches the wafer surface through the boundary layer. The apparatus and method may be used to clean a semiconductor wafer surface and/or grow an oxide layer on the wafer surface by oxidation.

摘要翻译： 用诸如臭氧的反应性气体处理半导体晶片的表面的设备和方法利用从气体喷嘴结构喷出的气态物流，以在半导体晶片表面上形成的处理流体的边界层上形成凹坑， 增加通过边界层到达晶片表面的反应气体的量。 该设备和方法可用于通过氧化来清洁半导体晶片表面和/或在晶片表面上生长氧化物层。

公开(公告)号：WO0128950A9

公开(公告)日：2002-05-10

申请号：PCT/US0029167

申请日：2000-10-19

申请人： PHIFER SMITH CORP

发明人： BOYERS DAVID G ,  CREMER JAY THEODORE JR

IPC分类号： B08B7/00 ,  B08B3/02 ,  B08B3/08 ,  C03C23/00 ,  G03F7/42 ,  H01L21/00 ,  H01L21/304 ,  H01L21/311 ,  H01L21/3213 ,  B08B3/00 ,  B08B3/10 ,  B08B3/14 ,  B08B9/00 ,  B08B9/20 ,  C23G1/00 ,  C23G1/02 ,  F23J1/00

CPC分类号： A61L2/183 ,  A61L2/22 ,  A61L2202/24 ,  B08B3/02 ,  B08B2203/005 ,  C03C23/00 ,  G03F7/423 ,  H01L21/02071 ,  H01L21/31116 ,  H01L21/31133 ,  H01L21/6708

摘要： A general method and apparatus for treating materials comprising the steps of dissolving ozone gas in a solvent at a predetermined temperature T1 to form an ozone solvent solution produced by the ozonated water supply (22), heating the ozone solvent solution by a heat exchanger (28) to a second predetermined temperature T2 which is greater than T1, and directing the flow of the ozone solvent solution to a dispensing nozzle (36) for treatment of the material (38).

摘要翻译： 一种用于处理材料的一般方法和装置，包括以下步骤：将臭氧气体溶解在预定温度T1的溶剂中，以形成由臭氧水供应（22）产生的臭氧溶剂溶液，通过热交换器（28）加热臭氧溶剂溶液 ）到大于T1的第二预定温度T2，并且将臭氧溶剂溶液的流动引导到用于处理材料（38）的分配喷嘴（36）。

公开(公告)号：WO99062649A1

公开(公告)日：1999-12-09

申请号：PCT/EP1999/003893

申请日：1999-06-04

IPC分类号： B08B3/08 ,  B08B3/10 ,  C02F1/78 ,  H01L21/00

CPC分类号： B08B3/10 ,  B08B3/04 ,  B08B3/08 ,  B08B2203/005 ,  C02F1/727 ,  C02F1/78 ,  C02F2209/23 ,  C02F2301/066 ,  Y10S134/902

摘要： The invention relates to a method and system for cleaning semiconductor elements accommodated in a tank which uses ozonized, deionized (DI) ultrapure water. According to the invention, ozone is generated in an ozone generator (3) according to the principal of silent electric discharge while admitting highly pure oxygen. Said ozone is fed to a contactor (7) through which DI water flows. The ozone is then dissolved in the DI water. While optionally admitting additional chemicals, the ozonized DI water is conducted through the tank (12) holding the semiconductor elements in order to clean the same, and the used DI water is carried away (15). In order to stabilize the ozone concentration, CO2 is added to the ozone/oxygen mixture generated by the ozone generator (7).

摘要翻译： 它是一种方法，并根据无声放电的高纯度氧气的臭氧的供给的原理（3）制作了半导体元件，其被容纳在罐中提出的臭氧化的去离子（DI）的高纯度水，其中，在臭氧发生器的清洁的植物 被送入去离子水接触器（7）的流过。 在这种情况下，臭氧溶解于去离子水。 而通过罐（12）与所述半导体元件提供额外的化学物质，来清洁他们的臭氧化的去离子水是任选通过与所使用的去离子水被排出（15）。 从臭氧发生器稳定的臭氧浓度（3）臭氧/氧气混合物产生二氧化碳加入。

公开(公告)号：WO99052654A1

公开(公告)日：1999-10-21

申请号：PCT/US1999/008516

申请日：1999-04-16

IPC分类号： G03F7/42 ,  B08B3/02 ,  B08B3/08 ,  B08B3/12 ,  B08B6/00 ,  H01L21/00 ,  H01L21/027 ,  H01L21/304 ,  H01L21/306 ,  B08B3/00

CPC分类号： H01L21/02052 ,  B08B3/02 ,  B08B3/08 ,  B08B2203/005 ,  B08B2230/01 ,  H01L21/6704

摘要： A novel chemistry and application technique used in a chemical process sequence to address the contamination concerns of the microelectronic fabrication industry is set forth. These concerns are namely: minimizing contamination for organics, particles, metal/ions, and silicon dioxide. Generally stated, cleaning of workpieces (20), such as semiconductor wafers, is accomplished by delivery of a chemical stream to the workpiece surface (20). Ozone is delivered either into the liquid process stream (70) or into the process environment (15). The chemical stream, which may be in the form of a liquid or vapor, is applied to the wafer in a system which enables control of the boundary layer which forms on the workpiece surface (20). The chemical stream may include components such as ammonium hydroxide for simultaneous particle and organic removal, another chemical to raise the pH of the solution, or other chemical additives designed to accomplish one or more specific cleaning tasks.

摘要翻译： 阐述了用于化学工艺顺序的新颖化学和应用技术，以解决微电子制造业的污染问题。 这些担心是：尽量减少有机物，颗粒，金属/离子和二氧化硅的污染。 通常，通过将化学物流输送到工件表面（20）来实现诸如半导体晶片的工件（20）的清洁。 臭氧被输送到液体处理流（70）中或进入过程环境（15）。 可以是液体或蒸气形式的化学物流被施加到能够控制在工件表面（20）上形成的边界层的系统中的晶片。 化学物流可以包括用于同时进行颗粒和有机物去除的诸如氢氧化铵的组分，用于提高溶液的pH的另一种化学品或者被设计成完成一个或多个特定清洁任务的其它化学添加剂。

公开(公告)号：WO98050947A1

公开(公告)日：1998-11-12

申请号：PCT/US1998/009340

申请日：1998-05-07

IPC分类号： B08B3/08 ,  B08B7/00 ,  H01L21/02 ,  H01L21/306 ,  H01L21/00 ,  B08B3/12

CPC分类号： H01L21/02054 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2230/01 ,  Y10S134/902 ,  Y10S438/906

摘要： The invention encompasses methods for cleaning surfaces of wafers or other semiconductor articles. Oxidizing is performed using an oxidation solution which is wetted onto the surface. The oxidation solution can include one or more of: water, ozone, hydrogen chloride, sulfuric acid, or hydrogen peroxide. A rinsing step removes the oxidation solution and inhibits further activity. The rinsed surface is thereafter preferably subjected to a drying step. The surface is exposed to an oxide removal vapor to remove semiconductor oxide therefrom. The oxide removal vapor can include one or more of: acids, such as a hydrogen halide, for example hydrogen fluoride or hydrogen chloride; water, isopropyl alcohol; or ozone. The processes can use centrifugal processing and spraying actions.

摘要翻译： 本发明包括用于清洁晶片或其它半导体产品表面的方法。 使用被润湿到表面上的氧化溶液进行氧化。 氧化溶液可以包括水，臭氧，氯化氢，硫酸或过氧化氢中的一种或多种。 漂洗步骤除去氧化溶液并抑制进一步的活性​​。 此后，漂洗后的表面优选进行干燥步骤。 将表面暴露于氧化物去除蒸气以从其中除去半导体氧化物。 氧化物去除蒸气可以包括一种或多种：酸，例如卤化氢，例如氟化氢或氯化氢; 水，异丙醇; 或臭氧。 这些工艺可以使用离心加工和喷涂动作。

公开(公告)号：WO1996011073A1

公开(公告)日：1996-04-18

申请号：PCT/DE1995001367

申请日：1995-10-05

申请人： E & S AUTOMATION GMBH ,  EWERS, Sönke ,  SCHULZ, Thomas

发明人： E & S AUTOMATION GMBH

IPC分类号： B08B09/32

CPC分类号： B08B9/32 ,  A61L2/025 ,  B08B3/00 ,  B08B3/126 ,  B08B2203/005

摘要： In the cleaning process the objects are first taken into a cleaning bath subjected to ultra-sound containing a biologically degradable cleaning agent and then into a rinsing bath in which they are ultrasonically sterilised. An indicator is added to the rinsing bath in order to indicate a change in the redox potential and thus helps to detect impurities in the rinsing bath and log them using a recorder. The process is particularly suitable for cleaning and removing germs from plastic bottles.

摘要翻译： 在清洗过程中，所述物品被第一馈送到与含有超声波清洗槽可生物降解的洗涤剂，然后通过漂洗浴，其中，所述制品进行灭菌用超声波超声处理。 的指示符剂加入到漂洗槽液以显示的氧化还原电位，并通过记录器的装置帮助在漂洗浴中的杂质，以确定和记录。 该方法特别适用于清洗和塑料瓶的消毒。

公开(公告)号：WO1993024841A1

公开(公告)日：1993-12-09

申请号：PCT/US1993004764

申请日：1993-05-19

申请人： THE COCA-COLA COMPANY

发明人： THE COCA-COLA COMPANY ,  FINE, David, H. ,  FRAIM, Freeman, W. ,  MACDONALD, Stephen, J. ,  THRASH, Kenneth, M., Jr.

IPC分类号： G01N35/00

CPC分类号： G01N1/2226 ,  B07C5/34 ,  B08B9/46 ,  B08B2203/005 ,  B29B17/00 ,  B29B17/02 ,  B29B2017/0203 ,  B29B2017/0275 ,  B29K2067/00 ,  B29K2105/065 ,  B29L2031/7158 ,  G01N1/2202 ,  G01N1/24 ,  G01N21/64 ,  G01N21/76 ,  G01N21/766 ,  G01N21/9018 ,  G01N2001/2223 ,  G01N2001/2229 ,  G01N2033/0081 ,  Y02W30/62 ,  Y02W30/622 ,  Y10T436/11 ,  Y10T436/113332 ,  Y10T436/118339 ,  Y10T436/17 ,  Y10T436/206664

摘要： Disclosed is a method and apparatus for sampling and determining the presence of certain substances, such as residues of contaminants in containers. The method includes steps of: injecting compressed air into said containers in order to displace at least a portion of the contents thereof; evacuating a sample of the container contents so displaced by applying suction thereto; and analyzing the sample evacuated to determine the presence or absence of the certain residues therein. The compressed air is injected through a nozzle into an opening in the containers to displace a portion of the container contents and form a sample cloud outside of the container. The sample cloud is then at least partially evacuated by suction and the sample is analyzed for the presence of contaminants such as nitrogen containing compounds or hydrocarbons. In one embodiment about 90 % of the sample evacuated is diverted from the analyzer and recirculated into the air injector. In another embodiment a fan is provided to blow remnants of the sample cloud downstream of the test station. A hood may be provided in a shroud assembly at the test station to provide proper aerodynamics for the region for removal of those remnants.

摘要翻译： 公开了一种用于取样和确定某些物质（例如容器中污染物残留物）的存在的方法和装置。 该方法包括以下步骤：将压缩空气注入所述容器中以便移动其内容物的至少一部分; 通过向其抽吸而排出容易收集的容器样品的抽吸物; 并分析抽空的样品以确定其中某些残留物的存在或不存在。 压缩空气通过喷嘴注入到容器中的开口中以置换容器内容物的一部分并在容器外部形成样品云。 然后通过抽吸至少部分抽空样品云，并分析样品中是否存在污染物，如含氮化合物或碳氢化合物。 在一个实施例中，大约90％的抽空样品从分析器转移并再循环到空气喷射器中。 在另一个实施例中，提供风扇以吹扫测试台下游的样本云的残余物。 可以在测试站的护罩组件中设置罩，以为该区域提供适当的空气动力学以移除这些残余物。

公开(公告)号：WO2014064571A1

公开(公告)日：2014-05-01

申请号：PCT/IB2013/059295

申请日：2013-10-11

申请人： KONINKLIJKE PHILIPS N.V.

发明人： JIN, Jianyu ,  WANG, Guangwei ,  HU, Peixin

IPC分类号： C02F1/461 ,  A61L2/03 ,  C02F1/467 ,  C02F1/66 ,  C02F1/72 ,  C02F1/78 ,  C02F1/76

CPC分类号： C02F1/4672 ,  B08B2203/005 ,  C02F1/4618 ,  C02F1/4674 ,  C02F1/66 ,  C02F1/722 ,  C02F1/76 ,  C02F1/78 ,  C02F2001/46133 ,  C02F2001/46185 ,  C02F2001/4619 ,  C02F2001/46195 ,  C02F2201/46135 ,  C02F2201/4614 ,  C02F2201/4618 ,  C02F2201/46185 ,  C02F2209/006 ,  C02F2209/04 ,  C02F2209/06 ,  C02F2301/08 ,  C02F2303/04 ,  C02F2303/18 ,  C02F2307/10 ,  C02F2307/12 ,  C25B9/00 ,  C25B15/02

摘要： The present invention provides a device for preparing an oxidative liquid, comprising: an oxidant source 12a (i.e. a second electrolysis unit) configured to provide an oxidant to a liquid; and a pH adjuster 14a (i.e. a first electrolysis unit) configured to adjust pH of the liquid to adjust an activity of the oxidant in the liquid. The pH value of the oxidative liquid can be effectively controlled by means of the device and method for preparing an oxidative liquid of the present invention, and by controlling a voltage and/or an electrical current applied on the first electrolysis unit 14a so as to adjust the oxidative activity of the oxidative liquid conveniently. In addition, the first electrolytic chamber or the second electrolytic chamber of the first electrolysis unit 14a of the present invention is arranged with a reactant capable of reacting with the H+ ions or OH- ions, which facilitates elimination of waste water discharge, and is environment friendly.

摘要翻译： 本发明提供了一种用于制备氧化液体的装置，包括：氧化剂源12a（即第二电解单元），被配置为向液体提供氧化剂; 以及pH调节器14a（即，第一电解单元），其被配置为调节液体的pH以调节液体中氧化剂的活性。 可以通过本发明的制备氧化液的装置和方法，并且通过控制施加在第一电解单元14a上的电压和/或电流来有效地控制氧化液的pH值，以便调节 氧化液的氧化活性方便。 此外，本发明的第一电解单元14a的第一电解室或第二电解室配置有能够与H +离子或OH-离子反应的反应物，这有助于排除废水排放，并且是环境 友善。