摘要:
The invention relates to a method for selective etching of SiC, the etching being carried out by applying a positive potential to a layer (3; 8) of p-type SiC being in contact with an etching solution containing fluorine ions and having an oxidising effect on SiC. The invention also relates to a method for producing a SiC micro structure having free hanging parts (i.e. diaphragm, cantilever or beam) on a SiC-substrate, a method for producing a MEMS device of SiC having a free hanging structure, and a method for producing a piezo-resistive pressure sensor comprising the step of applying a positive potential to a layer (8) of p-type SiC being in contact with an etching solution containing fluorine ions and having an oxidising effect on SiC.
摘要:
A novel porous film (3) is disclosed comprising a network of silicon columns in a continuous void which may be fabricated using high density plasma deposition at low temperatures, i.e., less than about 250 DEG C. This silicon film is a two-dimensional nano-sized array of rodlike columns. This void-column morphology can be controlled with deposition conditions and the porosity can be varied up to 90 %. The simultaneous use of low temperature deposition and etching in the plasma approach utilized, allows for the unique opportunity of obtaining columnar structure, a continuous void, and polycrystalline column composition at the same time. Unique devices may be fabricated using this porous continuous film by plasma deposition of this film on a glass, metal foil, insulator or plastic substrates (5).
摘要:
Systems and methods for etching topographic features in non- crystalline or metallic substrates are provided. A protective material is placed and patterned on a surface of the substrate to define exposed and protected regions of the substrate for etching in a liquid etchant having etching rates that are thermally activated. A nonuniform temperature profile is imposed on the substrate so that the temperatures and hence the etching rates at surfaces in the exposed regions are higher than those in the protected regions. Arrangements for imposing the nonuniform temperature profile include heating designated portions of the substrate with light radiation. Alternatively, the non-uniform temperature profile is developed as etching progresses by passing current pulses through the substrate in a manner that causes geometrically non-uniform heating of the substrate.
摘要:
Systems and methods for etching topographic features in non- crystalline or metallic substrates are provided. A protective material is placed and patterned on a surface of the substrate to define exposed and protected regions of the substrate for etching in a liquid etchant having etching rates that are thermally activated. A nonuniform temperature profile is imposed on the substrate so that the temperatures and hence the etching rates at surfaces in the exposed regions are higher than those in the protected regions. Arrangements for imposing the nonuniform temperature profile include heating designated portions of the substrate with light radiation. Alternatively, the non-uniform temperature profile is developed as etching progresses by passing current pulses through the substrate in a manner that causes geometrically non-uniform heating of the substrate.
摘要:
A capacitive electromechanical transducer includes a substrate, a cavity formed by a vibrating membrane held above the substrate with a certain distance between the vibrating membrane and the substrate by supporting portions arranged on the substrate, a first electrode whose surface is exposed to the cavity, and a second electrode whose surface facing the cavity is covered with an insulating film, wherein the first electrode is provided on a surface of the substrate or a lower surface of the vibrating membrane and the second electrode is provided on a surface of the vibrating membrane or a surface of the substrate so as to face the first electrode. In this transducer, fine particles composed of an oxide film of a substance constituting the first electrode are arranged on the surface of the first electrode, and the diameter of the fine particles is 2 to 200 nm.
摘要:
The invention relates to a method for producing a semiconductor component (100; ...; 700), particularly a multilayer semiconductor component, preferably a micromechanical component such as, in particular, a heat-conducting sensor, which has a semiconductor substrate (101), particularly made of silicon, and a sensor area (404). The aim of the invention is to economically produce a thermal insulation between the semiconductor substrate (101) and the sensor area (404). To this end, a porous layer (104; 501) is provided in the semiconductor component (100; ...; 700).
摘要:
Die Erfindung betrifft insbesondere ein Verfahren zur Herstellung eines Halbleiterbauelements (100; ...; 700), insbesondere ein mehrschichtiges Halbleiterbauelement, vorzugsweise ein mikromechanisches Bauelement, wie insbesondere ein Wärmeleitsensor, das ein Halbleitersubstrat (101), wie insbesondere aus Silizium, und einen Sensorbereich (404) aufweist. Zur kostengüngstigen Herstellung einer thermischen Isolierung zwischen dem Halbleitersubstrat (101) und dem Sensorbereich (404) wird erfindungsgemäss eine poröse Schicht (104; 501) in dem Halbleiterbauelement (100; ...; 700) vorgesehen.