Abstract:
Disclosed herein is an apparatus suitable for detecting an image, comprising: a plurality of pixels (150) configured to generate an electric signal upon exposure to a radiation; an electronics system (121) associated with each of the pixels (150), wherein the electronics system (121) comprises a first memory (641) on a first signal path (631) and a second memory (642) on a second signal path (632), both signal paths (631, 632) being between an input terminal (601) and an output terminal (602) of the electronics system (121); wherein each of the first memory (641) and the second memory (642) is configured to store the electric signal generated by the pixel (150) the electronics system (121) is associated with, configured to store the electric signal generated in another pixel (150), and configured to transmit the electric signal stored in the electronics system (121) to another pixel (150); wherein the electronics system (121) comprises a switch (610, 620) configured to select one of the signal paths (631, 632).
Abstract:
Error reduction in memristor programming includes programming an n-th switched memristor of a switched memristor array with an error-corrected target resistance. The error-corrected target resistance is a function of a resistance error of the switched memristor array and a target resistance of the n-th switched memristor. The n-th switched memristor programming is to reduce a total resistance error of the switched memristor array.
Abstract:
Technologies are generally described for systems, devices and methods effective to operate a memory device. A memory controller may compress initial data to produce compressed data. The memory controller may select a storage block in the memory device. The memory controller may identify one or more positions of defective cells in the selected storage block. The memory controller may manipulate the compressed data based on the identified one or more positions to produce manipulated data. The memory controller may store the manipulated data in the selected storage block.
Abstract:
A technique includes during in-service use of a memory package in a computer system, using a first interface to access a defective address memory of the memory package. The defective address memory is accessible by a manufacturer of the memory package prior to the in-service use using a second interface of the memory package other than the first interface. In connection with the in-service use of the memory package, the memory package is repair, a repair that includes storing a defective address in the defective address memory to change an address mapping for at least one cell of the storage array.
Abstract:
A memory[10,80]having a two-dimensional array of memory cells[15]organized as a plurality of rows[13]and columns[12]. The memory includes spare rows columns. A controller[85]in the memory tests the memory at power up and determines if any of the rows[13]or columns[12]are defective. A defective row or column is re-mapped to one of the spare rows or columns, respectively. Data specifying there-mapping is stored in a separate re-mapping address decode circuit[42,52]. When an address specifying a memory cell is received by the memory, a conventional address decode circuit[41,51]decodes the address at the same time the re-mapping decoder[42,52] searches for a match to the address. If the re-mapping decoder[42,52]finds the address, it inhibits the conventional decoder[41,51] and supplies the appropriate column or row select signals. The re-mapping decoder[41,51]is preferably constructed from a content-addressable memory.
Abstract:
The invention relates to a contact system comprising a dielectric antifuse (4) for an IC-memory component, and a method for producing one such contact system. Said contact system comprises a metallisation region (2, 3) which is arranged on a substrate (1) and is surrounded by an isolation layer (17). An isolation layer (4) used as a dielectric antifuse is arranged on said metallisation region (2, 3). A metallisation layer is then applied to the dielectric antifuse, said metallisation layer being used as a bit line (5) of the IC-memory component and being preferably produced according to RIE technology. As the dielectric antifuse (4) is arranged directly below the bit line (5), it is protected from damage which may occur during later steps in the process, especially when applying a top contact (9) to the bit line (5).
Abstract:
A memory device having selectable redundancy for maintaining high endurance and high reliability. The memory device has two memory arrays (12, 18) wherein both memory arrays have a plurality of address locations for storing data. A switching unit (24) is used to removably connect the address locations of the first memory array (12) to corresponding address locations of second memory array (18) in order to produce a first memory array having redundant address locations. If high reliability and redundancy is not required, a signal maybe sent to the switching unit (24) to disconnect the address locations of the first memory array (12) from the corresponding address locations of the second memory array (18) to produce a memory device having an increased amount of address locations for storing data as compared to the first memory array (12) having redundant address locations.