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    STABLE THERMAL RADICAL CURABLE SILICONE ADHESIVE COMPOSITIONS
    3.
    发明申请
    STABLE THERMAL RADICAL CURABLE SILICONE ADHESIVE COMPOSITIONS 审中-公开
    稳定的热可固化硅胶粘合剂组合物

    公开(公告)号：WO2014124364A1

    公开(公告)日：2014-08-14

    申请号：PCT/US2014/015571

    申请日：2014-02-10

    Applicant: DOW CORNING CORPORATION

    Inventor： LARSON, Kent ,  STEINBRECHER, Kristen ,  TONGE, James ,  ZARISFI, Afrooz

    IPC: C09J183/06 ,  C09J183/14 ,  C08L83/06 ,  C08L83/14

    CPC classification number: C09J183/06 ,  B05D3/0272 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K2003/2265 ,  C08L83/06 ,  C08L83/14 ,  C09J133/14 ,  C09J183/14

    Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane- functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

    Abstract translation: 提供了稳定的可热固化的硅氧烷组合物，其包含（I）具有一个或多个选自丙烯酸酯基和甲基丙烯酸酯基团的基团可固化基团的聚簇官能聚有机聚硅氧烷; （II）反应性树脂和聚合物; （III）自由基引发剂; （IV）水分固化引发剂; 和（V）交联剂。 反应性树脂和聚合物包括（a）有机聚硅氧烷聚合物和（b）烷氧基官能的有机聚硅氧烷树脂。 烷氧基官能的有机聚硅氧烷树脂包括在（iv）氢化硅烷化催化剂的存在下，（i）烯基官能的硅氧烷树脂，（ii）烷氧基硅烷官能的有机硅氧烷和（iii）端封体的反应的反应产物。 稳定的可热固化的硅氧烷组合物可用于电子应用。

    DUAL CURING POLYMERS AND METHODS FOR THEIR PREPARATION AND USE
    4.
    发明申请
    DUAL CURING POLYMERS AND METHODS FOR THEIR PREPARATION AND USE 审中-公开
    双固化聚合物及其制备和使用方法

    公开(公告)号：WO2008088523A1

    公开(公告)日：2008-07-24

    申请号：PCT/US2007/025215

    申请日：2007-12-10

    Applicant: DOW CORNING CORPORATION ,  ALVAREZ, Khristopher, Edward ,  SHEPHARD, Nick, Evan ,  TONGE, James

    Inventor： ALVAREZ, Khristopher, Edward ,  SHEPHARD, Nick, Evan ,  TONGE, James

    IPC: C08G77/14 ,  C08G77/18 ,  C08G77/50 ,  C08L83/06 ,  C08L83/14 ,  C08L101/10 ,  C09D183/06 ,  C09D183/14 ,  C09D201/10 ,  C09J183/06 ,  C09J183/14 ,  C09J201/10

    CPC classification number: C08G77/14 ,  C08G77/50 ,  C08J3/243 ,  C08J2383/06 ,  C08J2383/14 ,  C08L83/06 ,  C08L83/14 ,  C09D183/14 ,  C08L2666/28

    Abstract: A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R 2 2Si0 2/2 )b, (R 2 Si0 3/2 )c, (Si0 4/2 )d, (R 1 )f, and (R 2 3SiO 1/2 )g, where each R 1 is independently an oxygen atom or a divalent hydrocarbon group; each R 1 is independently divalent hydrocarbon group; each R 2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    Abstract translation: 聚合物通过辐射和湿气固化机制固化。 聚合物通过氢化硅烷化制备。 该聚合物可用于粘合剂组合物。 该聚合物包括式（I），（R 2）2 SiO 2/2/2）b，（R 2 SiO 2 / 2）c，（SiO 4/2/2）d，（R 1）2和（R 2）3 SiO 2 > 1/2 g，其中每个R 1独立地是氧原子或二价烃基; 每个R 1独立地是二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团，每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

    ORGANOPOLYSILOXANE CLUSTER POLYMER FOR RAPID AIR CURE
    5.
    发明申请
    ORGANOPOLYSILOXANE CLUSTER POLYMER FOR RAPID AIR CURE 审中-公开

    公开(公告)号：WO2022051204A1

    公开(公告)日：2022-03-10

    申请号：PCT/US2021/048163

    申请日：2021-08-30

    Applicant: DOW SILICONES CORPORATION ,  DOW GLOBAL TECHNOLOGIES LLC

    Inventor： THOMAS, Ryan ,  SHEPHARD, Nick ,  LU, Gang ,  SUNDERLAND, Julia

    IPC: C08G77/18 ,  C08G77/20 ,  C08G77/50 ,  C09J183/04 ,  C09J183/14

    Abstract: A composition contains an organopolysiloxane having the following average chemical structure: X3SiO-SiR2-R'-(R2SiO)x-R2Si-[Rb-(R2SiO)y-R2Si-Rb'-(R2SiO)z-R2Si]m-R'-R2SiO-SiX3; where X is -OSiR2-R'-R2SiO-R2Si-R"-A; R is an alkyl group having from 2 to 6 carbons and aryl groups; R', R", Rb and Rb' are divalent hydrocarbon groups comprising a chain of 2 to 6 methylene units; A is acrylate, methacrylate or trialkoxysilyl; provided that, on average, 60 to 90 mole-percent of the A groups are acrylate and methacrylate; Subscript m has an average value in a range of zero to 10; Subscripts x, y and z each has an average value in a range of zero to 1200; and provided that the average values of m, x, y and z are such that the sum of the average values for x, y and z is in a range of 300-1200 and the molar ratio of methylene units to siloxane units is less than 0.15.

    THERMALLY CURABLE SILICONE COMPOSITIONS AS TEMPORARY BONDING ADHESIVES
    9.
    发明申请
    THERMALLY CURABLE SILICONE COMPOSITIONS AS TEMPORARY BONDING ADHESIVES 审中-公开
    热固性硅酮组合物作为临时粘结粘合剂

    公开(公告)号：WO2014160067A1

    公开(公告)日：2014-10-02

    申请号：PCT/US2014/025751

    申请日：2014-03-13

    Applicant: DOW CORNING CORPORATION

    Inventor： FU, Peng-Fei ,  WANG, Sheng

    IPC: C09J183/14 ,  C08K3/36 ,  C08K5/5425

    CPC classification number: C09J183/14 ,  C08G77/12 ,  C08G77/20 ,  C08K5/5425 ,  H01L31/1892 ,  Y02E10/50

    Abstract: Provided in various embodiments are silicone-based storage stable temporary bonding adhesive compositions. The storage stable TBA compositions are formed by combining (e.g., mixing or blending) an alkenyl functional siloxane polymer, an alkenyl functional filler with a particle size below one micrometer, an SiH-containing crosslinker, a hydrosilylation catalyst, and a cure inhibitor where the molar ratio of the cure inhibitor and the hydrosilylation catalyst is greater than 40/1 and less than 500/1. The resulting TBA compositions may be one-part compositions. The TBA compositions can be used in varied applications including 3D chip integration, packaging applications, semiconductor devices, radio-frequency identification tags, chip cards, high-density memory devices, and microelectronic devices.

    Abstract translation: 在各种实施方案中提供了基于硅氧烷的储存稳定的临时粘合粘合剂组合物。 储存稳定的TBA组合物通过将烯基官能硅氧烷聚合物，粒度低于1微米的烯基官能填料，含SiH的交联剂，氢化硅烷化催化剂和固化抑制剂组合（例如，混合或共混）形成，其中 固化抑制剂和氢化硅烷化催化剂的摩尔比大于40/1且小于500/1。 得到的TBA组合物可以是一部分组合物。 TBA组合物可用于各种应用，包括3D芯片集成，封装应用，半导体器件，射频识别标签，芯片卡，高密度存储器件和微电子器件。

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