公开(公告)号：WO2009035906A2

公开(公告)日：2009-03-19

申请号：PCT/US2008/075308

申请日：2008-09-05

Applicant: DOW CORNING CORPORATION ,  BHAGWAGAR, Dorab, Edul ,  LILES, Donald ,  SHEPHARD, Nick, Evan ,  XU, Shengqing ,  LIN, Zuchen ,  ELAHEE, G.M., Fazley

Inventor： BHAGWAGAR, Dorab, Edul ,  LILES, Donald ,  SHEPHARD, Nick, Evan ,  XU, Shengqing ,  LIN, Zuchen ,  ELAHEE, G.M., Fazley

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIMl and TIM2 applications.

Abstract translation: 复合物包括导热金属基体和分散在其中的硅氧烷颗粒。 该复合材料可用于在电子设备中形成热界面材料。 该复合材料可用于TIM1和TIM2应用程序。

公开(公告)号：WO2009035907A3

公开(公告)日：2009-04-23

申请号：PCT/US2008075312

申请日：2008-09-05

Applicant: DOW CORNING ,  BHAGWAGAR DORAB EDUL ,  LILES DONALD ,  SHEPHARD NICK EVAN ,  XU SHENGQING ,  LIN ZUCHEN ,  ELAHEE G M FAZLEY

Inventor： BHAGWAGAR DORAB EDUL ,  LILES DONALD ,  SHEPHARD NICK EVAN ,  XU SHENGQING ,  LIN ZUCHEN ,  ELAHEE G M FAZLEY

IPC: H01L23/373

CPC classification number: H01L23/3737 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/3011 ,  Y10T428/12569 ,  Y10T428/254 ,  Y10T428/31678 ,  H01L2924/00

Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIMl and TIM2 applications in electronic devices.

Abstract translation: 热界面材料包括导热金属基体和分散在其中的粗聚合物颗粒。 该复合材料可用于电子设备中的TIM1和TIM2应用。

公开(公告)号：WO2007120197A3

公开(公告)日：2007-10-25

申请号：PCT/US2006/043073

申请日：2006-11-03

Applicant: DOW CORNING CORPORATION ,  DRAKE, Robert, Andrew ,  HABIMANA, Jean de la Croix ,  SHEPHARD, Nick, Evan ,  MOHAMED, Mustafa ,  KETOLA, Barry, Mark ,  TONGE, James, Steven ,  JENKINS, Stephen ,  ALTUM, Stephen

Inventor： DRAKE, Robert, Andrew ,  HABIMANA, Jean de la Croix ,  SHEPHARD, Nick, Evan ,  MOHAMED, Mustafa ,  KETOLA, Barry, Mark ,  TONGE, James, Steven ,  JENKINS, Stephen ,  ALTUM, Stephen

IPC: H01L31/0216 ,  H01L31/048 ,  C09J183/14 ,  C08L83/14

Abstract: This invention relates to a photovoltaic cell module and a process of applying a silicone based hot melt encapsulant material (102a, 104a) onto photovoltaic cells (103a) to form a photovoltaic cell module. There is provided a photovoltaic array with more efficient manufacturing and better utilization of the solar spectrum by using silicone hot melt sheets (102a, 104a) to give a silicone encapsulant photovoltaic device with the process ease of an organic encapsulant but the optical and chemical advantages of a silicone encapsulant. There is further provided a method for fabricating photovoltaic cells with increased throughput and optical efficiency when compared to prior art encapsulation methods. The preferred silicone material is provided in flexible sheet with hot melt properties and low surface tack.

公开(公告)号：WO2006073696A1

公开(公告)日：2006-07-13

申请号：PCT/US2005/044948

申请日：2005-12-13

Applicant: DOW CORNING CORPORATION ,  AHN, Dongchan ,  LOCH, Cheryl, Lynn ,  SHEPHARD, Nick, Evan ,  TONGE, James, Steven ,  OLNEY, Patricia, Ann

Inventor： AHN, Dongchan ,  LOCH, Cheryl, Lynn ,  SHEPHARD, Nick, Evan ,  TONGE, James, Steven ,  OLNEY, Patricia, Ann

IPC: C08F230/06 ,  C09D183/04 ,  C08K5/55

CPC classification number: C08F230/06 ,  C08K5/55 ,  C08L83/06 ,  Y10T428/24612 ,  C08L83/00 ,  C08L2666/28

Abstract: Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.

Abstract translation: 可固化组合物含有（i）可自由基聚合的有机硅单体，低聚物或聚合物; （ii）有机硼烷胺络合物; 任选地（iii）具有胺反应性基团的胺反应性化合物; 和（iv）当与含有活性氢和催化剂的化合物混合时能产生气体的组分。 可固化组合物可用作橡胶，胶带，粘合剂，泡沫，压敏粘合剂，保护涂层，薄膜，热塑性整体模制部件，热固性整体模制部件，密封剂，垫圈，密封件或O形环，模具附接胶 ，盖密封剂，密封剂，灌封化合物或保形涂层。 组合物还可以用于复合制品中，例如包括电气和电子连接器的整体结合的装置和水肺潜水面罩，其中将基材与组合物一起涂布或粘合在一起并固化。

公开(公告)号：WO2009114190A3

公开(公告)日：2010-07-29

申请号：PCT/US2009001623

申请日：2009-03-13

Applicant: DOW CORNING ,  HOULE KEVIN ,  HOWELL MALINDA ,  JOHNSON DAVID ,  JUEN DONNIE ,  KETOLA BARRY ,  SHEPHARD NICK EVAN

Inventor： HOULE KEVIN ,  HOWELL MALINDA ,  JOHNSON DAVID ,  JUEN DONNIE ,  KETOLA BARRY ,  SHEPHARD NICK EVAN

IPC: H01L31/048 ,  C08G77/52

CPC classification number: H01L21/67092 ,  B32B37/003 ,  B32B37/10 ,  B32B37/1009 ,  B32B38/1858 ,  B32B2309/62 ,  B32B2309/68 ,  B32B2457/12 ,  H01L31/048 ,  H01L31/1876 ,  Y02E10/50 ,  Y02P20/582 ,  Y02P70/521 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A photovoltaic cell module, a photovoltaic array including at least two modules, and a method of forming the module are provided. The photovoltaic cell module includes a substrate and a tie layer disposed on the substrate. The tie layer has a depth of penetration of from 1.1 to 100 mm and a tack value of less than -0.6 g.sec. The photovoltaic cell module also includes a photovoltaic cell disposed on the tie layer. The method of forming the photovoltaic cell module includes the steps of disposing the tie layer on the substrate and disposing the photovoltaic cell on the tie layer to form the photovoltaic cell module.

Abstract translation: 提供光伏电池模块，包括至少两个模块的光​​伏阵列，以及形成该模块的方法。 光伏电池模块包括基板和设置在基板上的连接层。 粘结层的穿透深度为1.1至100mm，粘着值小于-0.6g.sec。 光伏电池模块还包括设置在连接层上的光伏电池。 形成光伏电池模块的方法包括以下步骤：将接合层设置在衬底上，并将光伏电池设置在接合层上以形成光伏电池模块。

公开(公告)号：WO2009035907A4

公开(公告)日：2009-06-18

申请号：PCT/US2008075312

申请日：2008-09-05

Applicant: DOW CORNING ,  BHAGWAGAR DORAB EDUL ,  LILES DONALD ,  SHEPHARD NICK EVAN ,  XU SHENGQING ,  LIN ZUCHEN ,  ELAHEE G M FAZLEY

Inventor： BHAGWAGAR DORAB EDUL ,  LILES DONALD ,  SHEPHARD NICK EVAN ,  XU SHENGQING ,  LIN ZUCHEN ,  ELAHEE G M FAZLEY

IPC: H01L23/373

CPC classification number: H01L23/3737 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/3011 ,  Y10T428/12569 ,  Y10T428/254 ,  Y10T428/31678 ,  H01L2924/00

Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIMl and TIM2 applications in electronic devices.

Abstract translation: 热界面材料包括导热金属基体和分散在其中的粗聚合物颗粒。 该复合材料可用于电子设备中的TIMI和TIM2应用。

公开(公告)号：WO2008088523A1

公开(公告)日：2008-07-24

申请号：PCT/US2007/025215

申请日：2007-12-10

Applicant: DOW CORNING CORPORATION ,  ALVAREZ, Khristopher, Edward ,  SHEPHARD, Nick, Evan ,  TONGE, James

Inventor： ALVAREZ, Khristopher, Edward ,  SHEPHARD, Nick, Evan ,  TONGE, James

IPC: C08G77/14 ,  C08G77/18 ,  C08G77/50 ,  C08L83/06 ,  C08L83/14 ,  C08L101/10 ,  C09D183/06 ,  C09D183/14 ,  C09D201/10 ,  C09J183/06 ,  C09J183/14 ,  C09J201/10

CPC classification number: C08G77/14 ,  C08G77/50 ,  C08J3/243 ,  C08J2383/06 ,  C08J2383/14 ,  C08L83/06 ,  C08L83/14 ,  C09D183/14 ,  C08L2666/28

Abstract: A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R 2 2Si0 2/2 )b, (R 2 Si0 3/2 )c, (Si0 4/2 )d, (R 1 )f, and (R 2 3SiO 1/2 )g, where each R 1 is independently an oxygen atom or a divalent hydrocarbon group; each R 1 is independently divalent hydrocarbon group; each R 2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

Abstract translation: 聚合物通过辐射和湿气固化机制固化。 聚合物通过氢化硅烷化制备。 该聚合物可用于粘合剂组合物。 该聚合物包括式（I），（R 2）2 SiO 2/2/2）b，（R 2 SiO 2 / 2）c，（SiO 4/2/2）d，（R 1）2和（R 2）3 SiO 2 > 1/2 g，其中每个R 1独立地是氧原子或二价烃基; 每个R 1独立地是二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团，每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

公开(公告)号：WO2007120197A2

公开(公告)日：2007-10-25

申请号：PCT/US2006043073

申请日：2006-11-03

Applicant: DOW CORNING ,  DRAKE ROBERT ANDREW ,  HABIMANA JEAN DE LA CROIX ,  SHEPHARD NICK EVAN ,  MOHAMED MUSTAFA ,  KETOLA BARRY MARK ,  TONGE JAMES STEVEN ,  JENKINS STEPHEN ,  ALTUM STEPHEN

Inventor： DRAKE ROBERT ANDREW ,  HABIMANA JEAN DE LA CROIX ,  SHEPHARD NICK EVAN ,  MOHAMED MUSTAFA ,  KETOLA BARRY MARK ,  TONGE JAMES STEVEN ,  JENKINS STEPHEN ,  ALTUM STEPHEN

CPC classification number: H01L31/18 ,  C08L83/14 ,  H01L31/02167 ,  H01L31/0481 ,  Y02E10/50 ,  C08L2666/44

Abstract: This invention relates to a photovoltaic cell module and a process of applying a silicone based hot melt encapsulant material (102a, 104a) onto photovoltaic cells (103a) to form a photovoltaic cell module. There is provided a photovoltaic array with more efficient manufacturing and better utilization of the solar spectrum by using silicone hot melt sheets (102a, 104a) to give a silicone encapsulant photovoltaic device with the process ease of an organic encapsulant but the optical and chemical advantages of a silicone encapsulant. There is further provided a method for fabricating photovoltaic cells with increased throughput and optical efficiency when compared to prior art encapsulation methods. The preferred silicone material is provided in flexible sheet with hot melt properties and low surface tack.

Abstract translation: 本发明涉及一种光伏电池模块和将硅树脂基热熔胶包封材料（102a，104a）施加到光伏电池（103a）上以形成光伏电池模块的方法。 通过使用硅树脂热熔片（102a，104a）提供具有更高效制造和更好地利用太阳能光谱的光伏阵列，以提供具有有机密封剂的工艺容易性的硅树脂密封剂光伏器件，但具有光学和化学优点 硅胶密封剂。 与现有技术的封装方法相比，进一步提供了一种具有增加的生产量和光学效率的光伏电池的制造方法。 优选的硅酮材料以柔软的片材提供，具有热熔性和低表面粘性。

公开(公告)号：WO2006122025B1

公开(公告)日：2006-12-21

申请号：PCT/US2006017718

申请日：2006-05-09

Applicant: DOW CORNING ,  ALVAREZ KHRISTOPHER EDWARD ,  SHEPHARD NICK EVAN ,  TONGE JAMES STEVEN

Inventor： ALVAREZ KHRISTOPHER EDWARD ,  SHEPHARD NICK EVAN ,  TONGE JAMES STEVEN

IPC: H01L21/768 ,  H05K3/28

CPC classification number: C09D5/086 ,  H01J9/02 ,  H01J11/10 ,  H01J11/22 ,  H01J2211/225 ,  H01L21/76838 ,  H05K3/285 ,  H05K3/323 ,  H05K2201/0769 ,  H05K2203/124

Abstract: A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e.g., a plasma display panel (PDP) or a liquid crystal display (LCD).

Abstract translation: 用于减少电子电路中的Ag电迁移的方法包括用抗电迁移组合物处理电子电路的步骤。 该过程在制造具有靠近在一起的电子电路的电子设备（诸如电阻器，电容器和显示器，例如等离子体显示面板（PDP）或液晶显示器（LCD））中是有用的。

公开(公告)号：WO2009114190A2

公开(公告)日：2009-09-17

申请号：PCT/US2009/001623

申请日：2009-03-13

Applicant: DOW CORNING CORPORATION ,  HOULE, Kevin ,  HOWELL, Malinda ,  JOHNSON, David ,  JUEN, Donnie ,  KETOLA, Barry ,  SHEPHARD, Nick, Evan

Inventor： HOULE, Kevin ,  HOWELL, Malinda ,  JOHNSON, David ,  JUEN, Donnie ,  KETOLA, Barry ,  SHEPHARD, Nick, Evan

IPC: H01L31/048

CPC classification number: H01L21/67092 ,  B32B37/003 ,  B32B37/10 ,  B32B37/1009 ,  B32B38/1858 ,  B32B2309/62 ,  B32B2309/68 ,  B32B2457/12 ,  H01L31/048 ,  H01L31/1876 ,  Y02E10/50 ,  Y02P20/582 ,  Y02P70/521 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A photovoltaic cell module, a photovoltaic array including at least two modules, and a method of forming the module are provided. The photovoltaic cell module includes a substrate and a tie layer disposed on the substrate. The tie layer has a depth of penetration of from 1.1 to 100 mm and a tack value of less than -0.6 g.sec. The photovoltaic cell module also includes a photovoltaic cell disposed on the tie layer. The method of forming the photovoltaic cell module includes the steps of disposing the tie layer on the substrate and disposing the photovoltaic cell on the tie layer to form the photovoltaic cell module.

Abstract translation: 提供光伏电池模块，包括至少两个模块的光​​伏阵列，以及形成该模块的方法。 光伏电池模块包括基板和设置在基板上的连接层。 粘结层的穿透深度为1.1至100mm，粘着值小于-0.6g.sec。 光伏电池模块还包括设置在连接层上的光伏电池。 形成光伏电池模块的方法包括以下步骤：将接合层设置在衬底上，并将光伏电池设置在接合层上以形成光伏电池模块。