公开(公告)号：WO2022028675A1

公开(公告)日：2022-02-10

申请号：PCT/EP2020/071880

申请日：2020-08-04

Applicant: APPLIED MATERIALS, INC. ,  LONG, Michael

Inventor： LONG, Michael

IPC: C23C14/04 ,  C23C14/12 ,  C23C14/24 ,  C23C14/54 ,  C23C14/56 ,  C23C16/455 ,  C23C14/042 ,  C23C14/541 ,  C23C14/562 ,  C23C16/45563 ,  C23C16/45578

Abstract: Embodiments described herein relate to a vapor source (100) for depositing an evaporated material on a substrate (10) in a vacuum chamber. The vapor source (100) includes a vapor distribution pipe (110) with a plurality of nozzles for directing the evaporated material toward the substrate, wherein at least one nozzle (120) of the plurality of nozzles includes a nozzle channel (121) extending along a nozzle axis (A) from a nozzle inlet (122) to an orifice (123), and a nozzle insert (130) with a heat shield portion (131) arranged centrally inside the nozzle channel (121) for reducing heat radiation from the nozzle channel through the orifice (123). Further described are a nozzle for directing the evaporated material toward the substrate, a vacuum deposition system (200), and a method for depositing an evaporated material on a substrate.

公开(公告)号：WO2022240549A1

公开(公告)日：2022-11-17

申请号：PCT/US2022/025197

申请日：2022-04-18

Applicant: APPLIED MATERIALS, INC.

Inventor： BANGERT, Stefan ,  DEPPISCH, Thomas ,  BUSCHBECK, Wolfgang

IPC: C23C14/56 ,  C23C14/54 ,  C23C16/54 ,  C23C16/46 ,  C23C16/458 ,  C23C14/505 ,  C23C14/541 ,  C23C14/562 ,  C23C16/4584 ,  C23C16/463

Abstract: A roller (100) for transporting a flexible substrate is described. The roller (100) includes a first coolant supply (110) for cooling a first part (101) of the roller (100) and a second coolant supply (120) for cooling a second part (102) and a third part (103) of the roller (100). The first part (101) is provided between the second part (102) and the third part (103). Additionally, a vacuum processing apparatus including a roller and a method of cooling a roller are described.

公开(公告)号：WO2022039966A1

公开(公告)日：2022-02-24

申请号：PCT/US2021/045261

申请日：2021-08-09

Applicant: APPLIED MATERIALS, INC.

Inventor： LOPP, Andreas ,  BANGERT, Stefan ,  BUSCHBECK, Wolfgang

IPC: C23C14/56 ,  C23C14/54 ,  C23C14/24 ,  C23C14/02 ,  C23C14/58 ,  C23C16/54 ,  C23C16/46 ,  C23C16/02 ,  C23C16/56 ,  C23C14/16 ,  C23C14/26 ,  C23C14/541 ,  C23C14/562 ,  H01M4/0423

Abstract: One or more heating assemblies for a material deposition apparatus for pre-heating a substrate before entering a material deposition area and/or for post-heating the substrate after exiting the material deposition area are described.

公开(公告)号：WO2022002383A1

公开(公告)日：2022-01-06

申请号：PCT/EP2020/068498

申请日：2020-07-01

Applicant: APPLIED MATERIALS, INC. ,  MALMS, Christopher ,  SCHÄFER-KOPYTTO, Daniel ,  BERGMANN, Tobias

Inventor： MALMS, Christopher ,  SCHÄFER-KOPYTTO, Daniel ,  BERGMANN, Tobias

IPC: C23C14/54 ,  C23C16/48 ,  C23C14/541 ,  C23C16/481 ,  C23C16/482 ,  H01L21/67115

Abstract: A vacuum processing apparatus (400), comprising a vacuum chamber (410) having a chamber wall portion (202); a lamp (100), the lamp (100) comprising a lamp body (102) having a first sealed interior portion (124) disposed within the vacuum chamber (410), a seal portion (120), and a second sealed interior portion (122) between the first sealed interior portion (124) and the seal portion (120), the second sealed interior portion (122) being disposed within the vacuum chamber (410); a filament (104) provided in the first sealed interior portion (124); and a wire (106) electrically connected to the filament (104) and provided in the second sealed interior portion (122); the apparatus further comprising: a heat sink (130) coupled to the chamber wall portion (202) and the second sealed interior portion.

公开(公告)号：WO2022002381A1

公开(公告)日：2022-01-06

申请号：PCT/EP2020/068493

申请日：2020-07-01

Applicant: APPLIED MATERIALS, INC. ,  MALMS, Christopher

Inventor： MALMS, Christopher

IPC: C23C14/54 ,  C23C16/48 ,  C23C14/541 ,  C23C16/481 ,  C23C16/482 ,  H01L21/67115

Abstract: A lamp heater (250) for a chamber includes a glass tube (252) having two sealed end portions (255); two cold wire portions (256) each extending through a respective one of the two sealed end portions (255); and a heating wire (251) arranged in the glass tube (252) and electrically connecting the two cold wire portions (256), the heating wire (251) containing a nickel-chromium alloy.

公开(公告)号：WO2021198355A2

公开(公告)日：2021-10-07

申请号：PCT/EP2021/058475

申请日：2021-03-31

Applicant: APEVA SE

Inventor： KEIPER, Dietmar

IPC: C23C14/12 ,  C23C14/50 ,  C23C14/54 ,  C23C16/458 ,  C23C16/46 ,  C23C14/541 ,  C23C16/4581 ,  C23C16/4586 ,  C23C16/466

Abstract: Die Erfindung betrifft einen Substrathalter(2) zur Verwendung in einer Substratbehandlungsvorrichtung (1), aufweisend eine durch Wärmezufuhr oder Wärmeabfuhr temperierbare Oberseite (2'), die bei einer Substratbehandlung ein Substrat (7) trägt, dessen sich in einer Ebene parallel zur Oberseite (2') erstreckende Rückseite (8) zur Oberseite (2') weist, wobei die Oberfläche der Rückseite (8) zumindest eine unebene oder aus einer Ebene herausgewölbte Zone (8') aufweist sowie eine Vorrichtung zur Durchführung eines Substratbehandlungprozesses mit einem derartigen Substrathalter (2). Um eine gleichmäßige Erwärmung des Substrates (7) zu gewährleisten, ist eine auf der Oberseite (2') angeordnete, elastisch verformbare Substratauflage (10) vorgesehen, die aufgrund einer elastischen Verformung in berührende Anlage an die Oberfläche der Rückseite (8, 8') tritt. Die Substratauflage (10) kann von einer Mehrzahl von elastischen Strukturelementen (11, 12, 13, 14, 15) gebildet sein.

公开(公告)号：WO2022002382A1

公开(公告)日：2022-01-06

申请号：PCT/EP2020/068496

申请日：2020-07-01

Applicant: APPLIED MATERIALS, INC. ,  MALMS, Christopher ,  BERGMANN, Tobias

Inventor： MALMS, Christopher ,  BERGMANN, Tobias

IPC: C23C16/44 ,  C23C16/46 ,  C23C16/48 ,  C23C14/54 ,  H01L21/67 ,  C23C14/541 ,  C23C16/4401 ,  C23C16/481 ,  C23C16/482 ,  H01L21/67115 ,  H01L21/67253 ,  H01L21/67288

Abstract: A method for operating a chamber having at least one electric load having at least one voltage-carrying part exposed to varying pressure conditions in the chamber is provided. The method includes: supplying a voltage within a nominal range not exceeding a maximum voltage (U1) to the at least one electric load arranged in the chamber when the pressure in the chamber is outside of a critical pressure range (301), the critical pressure range (301) being defined as the pressure range in which arcing in the chamber occurs when the maximum voltage is supplied to the at least one electric load; and supplying a voltage not exceeding a pressure-dependent arc-free voltage (U2) to the at least one electric load arranged in the chamber when the pressure in the chamber is within the critical pressure range (301) to maintain operating the at least one electric load, the pressure-dependent arc-free voltage (U2) is lower than the maximum voltage (U1).

公开(公告)号：WO2021247379A1

公开(公告)日：2021-12-09

申请号：PCT/US2021/034598

申请日：2021-05-27

Applicant: APPLIED MATERIALS, INC.

Inventor： LOPP, Andreas ,  BANGERT, Stefan

IPC: C23C14/56 ,  C23C14/24 ,  C23C14/22 ,  C23C14/541 ,  C23C14/542

Abstract: A temperature-controlled shield for an evaporation source is described. The temperature-controlled shield is configured to provide a pre -heating zone or a post-cooling zone.

公开(公告)号：WO2021133635A1

公开(公告)日：2021-07-01

申请号：PCT/US2020/065658

申请日：2020-12-17

Applicant: APPLIED MATERIALS, INC.

Inventor： HOI, Siew Kit ,  ZHONG, Yaoying ,  WANG, Xinxin ,  CHONG, Zheng Min Clarence

IPC: C23C14/14 ,  C23C14/58 ,  C23C14/54 ,  C23C14/34 ,  C23C14/06 ,  C23C14/3435 ,  C23C14/541

Abstract: Methods and apparatus for performing physical vapor deposition in a reactor chamber to form aluminum material on a substrate including: depositing a first aluminum layer atop a substrate to form a first aluminum region having a first grain size and a first temperature; and cooling the first aluminum region atop a substrate to a second temperature at a rate sufficient to increase the first grain size to a second grain size.

公开(公告)号：WO2023057706A1

公开(公告)日：2023-04-13

申请号：PCT/FR2022/051846

申请日：2022-09-29

Applicant: SAFRAN ELECTRONICS & DEFENSE

Inventor： DUPEYRAT, Cyril ,  PARAILLOUS, Maxime ,  FLEURY, Joël

IPC: C23C14/50 ,  C23C14/54 ,  C23C16/458 ,  C23C16/46 ,  H01L21/687 ,  H01L21/67 ,  C23C14/541 ,  C23C16/4585 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/67248

Abstract: Ce dispositif de chauffage d'un substrat (2) dans une enceinte sous vide pour dépôt multicouche sur ledit substrat (2) comprend une source de chaleur (5) destinée à être en contact avec le substrat (2), un support (6) de la source de chaleur (5), un isolant thermique (7) positionné entre le support (6) et la source de chaleur (5), une batterie d'alimentation (8) de la source de chaleur (5), et une structure de maintien (15) du substrat (2) contre la source de chaleur (5).