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公开(公告)号：WO2020096906A1
公开(公告)日：2020-05-14
申请号：PCT/US2019/059496
申请日：2019-11-01
Applicant: COVENTYA, INC.
Inventor： BOKISA, George , THEURET, Claire
Abstract: An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.
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公开(公告)号：WO2018057707A1
公开(公告)日：2018-03-29
申请号：PCT/US2017/052668
申请日：2017-09-21
Applicant: MACDERMID ENTHONE INC.
Inventor： PANECCASIO, Vincent , WHITTEN, Kyle , HURTUBISE, Richard , COMMANDER, John , ROUYA, Eric
Abstract: An electrolytic plating composition for superfilling submicron features in a semiconductor integrated circuit device and a method of using the same. The composition comprises (a) a source of copper ions to electrolytically deposit copper onto the substrate and into the electrical interconnect features, and (b) a suppressor comprising at least three amine sites, said polyether comprising a block copolymer substituent comprising propylene oxide (PO) repeat units and ethylene oxide (EO) repeat units, wherein the number average molecular weight of the suppressor compound is between about 1,000 and about 20,000.
Abstract translation: 用于超级填充半导体集成电路器件中亚微米特征的电解镀覆组合物及其使用方法 所述组合物包含（a）铜离子源以将铜电解沉积到基材上和电互连部件中，和（b）包含至少三个胺部位的抑制剂，所述聚醚包含嵌段共聚物取代基，所述嵌段共聚物取代基包含环氧丙烷 ）重复单元和环氧乙烷（EO）重复单元，其中抑制剂化合物的数均分子量在约1,000和约20,000之间。
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公开(公告)号：WO2018057490A1
公开(公告)日：2018-03-29
申请号：PCT/US2017/052185
申请日：2017-09-19
Applicant: MACDERMID ENTHONE INC.
Inventor： NAJJAR, Elie , SHAO, Wenbo , PANECCASIO, Vincent , HURTUBISE, Richard , COMMANDER, John , LI, Ivan , VERBUNT, Han , KRAMER, Frank, R. , YE, Pingping , RICHARDSON, Thomas , LIU, Tao-Chi
CPC classification number: C25D3/38 , C25D5/48 , C25D7/126 , H01L23/00 , H01L31/022441 , H01L31/0682 , Y02E10/547
Abstract: A process for electrodepositing a copper layer on a metalizing substrate is described. The metalizing substrate comprising a seminal conductive layer positioned on and in electrically conductive communication with a photovoltaic cell panel comprising a semiconductor material. The process comprises the steps of (i) contacting the metalizing substrate with an aqueous electrodeposition composition, and (ii) supplying electrolytic current to the aqueous electrodeposition composition to cause deposit of copper on the metalizing substrate. The aqueous electrodeposition composition comprises (a) a source of copper ions, (b) an acid, (c) chloride ions, and (d) a depolarizer comprising an organic sulfonate anion selected from the group consisting of an O-alkyl-S-sulfohydrocarbylxanthate, mercaptopropane sulfonate, bis(sulfopropyl)disulfide, N,N-dimethylamino-dithiocarbamoyl-l -propane sulfonate, acid hydrolysis products of said organic sulfonates, and mixtures of said organic sulfonates and hydrolysis products.
Abstract translation: 描述了用于在金属化基底上电沉积铜层的方法。 该金属化基板包括位于包含半导体材料的光伏电池板上并与之导电连接的精液导电层。 该方法包括以下步骤：（i）使金属化基材与含水电沉积组合物接触，和（ii）向含水电沉积组合物供应电解电流以引起铜在金属化基材上的沉积。 （a）铜离子源，（b）酸，（c）氯离子和（d）包含选自O-烷基-S 磺基烃基黄原酸酯，巯基丙烷磺酸盐，双（磺丙基）二硫化物，N，N-二甲基氨基 - 二硫代氨基甲酰基-1-丙烷磺酸盐，所述有机磺酸盐的酸水解产物以及所述有机磺酸盐和水解产物的混合物。
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公开(公告)号：WO2018018161A1
公开(公告)日：2018-02-01
申请号：PCT/CA2017/050914
申请日：2017-07-28
Applicant: SIMON FRASER UNIVERSITY
Abstract: A method of electrochemical deposition of a metallic material onto a substrate is provided. The method includes providing an alkaline solution of hydroxide ions, immersing a metallic material precursor and the substrate into the alkaline solution to form an electrochemical bath, and electrochemically depositing a textured layer of the metallic material onto the substrate. A method of electrochemical deposition of a textured nanoparticle is provided. The method includes providing an alkaline solution of hydroxide ions, immersing the metallic material into the alkaline solution to form an electrochemical bath, and precipitating the textured nanoparticles from the electrochemical bath. A method of electrochemical deposition of a metallic material onto a nanoparticle is provided. The method includes providing an alkaline solution of hydroxide ions, immersing the metallic material and the nanoparticle into the alkaline solution to form an electrochemical bath, and depositing a textured layer of the metallic material onto the nanoparticle.
Abstract translation: 提供了一种将金属材料电化学沉积到衬底上的方法。 该方法包括提供氢氧根离子的碱性溶液，将金属材料前体和基底浸入碱性溶液中以形成电化学浴，并且将金属材料的织构化层电化学沉积到基底上。 提供了一种电化学沉积纹理纳米颗粒的方法。 该方法包括提供氢氧根离子的碱性溶液，将金属材料浸入碱性溶液中以形成电化学浴，并从电化学浴中沉淀出具有纹理的纳米颗粒。 提供了一种将金属材料电化学沉积到纳米粒子上的方法。 该方法包括提供氢氧根离子的碱性溶液，将金属材料和纳米粒子浸入碱性溶液中以形成电化学浴，并将金属材料的织构层沉积到纳米粒子上。
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5.发明申请
公开(公告)号：WO2017023743A1
公开(公告)日：2017-02-09
申请号：PCT/US2016/044689
申请日：2016-07-29
Applicant: UNIVERSITY OF SOUTH FLORIDA
Inventor： WAQAR, Ammar, Bin , CAI, Wenjun
Abstract: A method for electrodepositing aluminum and nickel using a single electrolyte solution includes forming a mixture comprising nickel chloride and an organic halide, adding aluminum chloride to the electrolyte solution in an amount at which the mixture becomes an acidic electrolyte solution, providing a working electrode and a counter electrode in the acidic electrolyte solution, and applying a waveform to the counter electrode using cyclic voltammetry to cause aluminum and nickel ions to be deposited on the working electrode.
Abstract translation: 使用单一电解质溶液电沉积铝和镍的方法包括形成包含氯化镍和有机卤化物的混合物，向混合物中加入氯化铝至混合物变成酸性电解质溶液的量，提供工作电极和 在酸性电解液中的对电极，并使用循环伏安法向对置电极施加波形，使铝和镍离子沉积在工作电极上。
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Patent Agency Ranking
公开(公告)号：WO2016195392A1
公开(公告)日：2016-12-08
申请号：PCT/KR2016/005851
申请日：2016-06-02
CPC classification number: C25D3/12 , C23C18/32 , C23C18/42 , C25D3/02 , C25D3/50 , C25D3/54 , H04B1/3888 , H05K5/00
Abstract: 본 발명은 강도 증강용 구조체 및 그의 제조방법에 관한 것으로, 더 상세히는 비금속 베이스 또는 금속 베이스의 표면상에 텅스텐을 함유한 물질로 이루어진 코팅층이 형성된 강도 증강용 구조체에 관한 것이다. 본 발명에 따르면 현재 제작되어 사용되고 있는 합성수지 및 금속 제품을 대체할 수 있고, 또한 합성수지나 금속 제품의 물성에 비해 우수한 물성, 기계적 특성을 나타내며, 필요에 따라 본 발명에 따른 구조체의 금속 도금 표면을 금, 은 등의 각종 귀금속으로 다시 도금하여, 수요자의 요구에 부응할 수 있다.
Abstract translation: 本发明涉及增强强度的结构及其制造方法。 更具体地，本发明涉及一种用于增强其上形成有涂层的强度的结构，其中所述涂层由非金属或金属基底的表面上的含钨材料形成。 本发明可以代替目前制造和使用的合成树脂和金属制品; 还表现出优于合成树脂或金属制品的物理和机械性能; 并且可以根据需要用根据需要的各种贵金属如金，银等将根据本发明的结构的镀金表面再镀覆来满足消费者的需求。
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公开(公告)号：WO2016044583A1
公开(公告)日：2016-03-24
申请号：PCT/US2015/050671
申请日：2015-09-17
Applicant: XTALIC CORPORATION
Inventor： ABBOTT, Joshua, Garth , FREYDINA, Evgeniya
CPC classification number: C25D3/44 , C25C3/06 , C25D3/56 , C25D3/665 , C25D5/18 , C25D21/14 , C25D21/18
Abstract: Leveling additives, their use in electrodeposition, and regeneration are described. In one embodiment, an electrodeposition bath may include a non-aqueous liquid and an optionally substituted aromatic hydrocarbon. The optionally substituted aromatic hydrocarbon may be protonated. A method prepares an electrodeposition bath with a leveling additive may include: adding an optionally substituted basic aromatic hydrocarbon to a non-aqueous liquid; and protonating the basic aromatic hydrocarbon in the non-aqueous liquid.
Abstract translation: 描述了流平助剂，它们在电沉积中的应用和再生。 在一个实施方案中，电沉积浴可以包括非水性液体和任选取代的芳族烃。 任选取代的芳族烃可以被质子化。 用流平添加剂制备电沉积浴的方法可包括：向非水性液体中加入任选取代的碱性芳族烃; 并使非水性液体中的碱性芳族烃质子化。
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8.发明申请ELEKTRISCH LEITENDE FLÜSSIGKEITEN AUF DER BASIS VON METALL-DIPHOSPHONAT-KOMPLEXEN 审中-公开导电液体的基于金属二膦络合物
公开(公告)号：WO2015091854A2
公开(公告)日：2015-06-25
申请号：PCT/EP2014/078556
申请日：2014-12-18
Applicant: SCHLENK METALLFOLIEN GMBH & CO. KG , SEIDEL, Andreas
Inventor： SEIDEL, Andreas , DISTELRATH, Fabian , BOOZ, Thomas
IPC: C25D3/02
CPC classification number: C25D7/0692 , C25D3/02 , C25D3/30 , C25D3/38 , C25D3/54 , C25D5/18 , C25D5/34 , C25D7/0628 , C25D7/0664 , C25F3/02
Abstract: Die vorliegende Erfindung betrifft elektrisch leitende Flüssigkeiten auf der Basis von Diphosphonat-Komplexen sowie deren Verwendung bei Verfahren zur elektrolytischen Oberflächenmodifizierung eines flächigen Metallwerkstücks. Die Erfindung betrifft ferner die mit diesem Verfahren hergestellten flächigen Metallwerkstücke sowie die Verwendung der Metallwerkstücke als Substrat für die Bildung von festen Haftverbänden mit einer Vielzahl von Materialien und für die Aufnahme von flüssigen und festen Stoffen.
Abstract translation: 本发明涉及二膦酸酯配合物的基础上和它们在工艺用于金属板工件的电解表面改性使用上的导电流体。 本发明还涉及通过该方法，并使用金属工件的作为用于形成固体粘合剂敷料具有各种材料的基板和用于液体和固体的吸收所产生的片材金属工件。
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公开(公告)号：WO2015066848A1
公开(公告)日：2015-05-14
申请号：PCT/CN2013/086585
申请日：2013-11-06
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC , DOW GLOBAL TECHNOLOGIES LLC , DUAN, Lingli , NIAZIMBETOVA, Zuhra I. , CHEN, Chen , SUN, Tong , RZEZNIK, Maria Anna
Inventor： DUAN, Lingli , NIAZIMBETOVA, Zuhra I. , CHEN, Chen , SUN, Tong , RZEZNIK, Maria Anna
CPC classification number: C25D3/32 , C08G73/0616 , C09D179/04 , C25D3/38 , C25D3/58 , C25D3/60 , C25D7/00 , C25D7/123 , H05K3/10 , H05K3/188 , H05K2203/0723 , C08K3/30 , C08L71/02
Abstract: Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.
Abstract translation: 聚胺和含氮环状化合物的反应产物的聚合物包括在金属电镀组合物中以在基材上提供水平的金属沉积物。
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10.发明申请ZIRCONIUM ALLOY ELECTROPLATING SOLUTION COMPOSITION AND PLATED PRODUCT USING THE SAME 审中-公开锆合金电镀解决方案组合物和使用它的产品
公开(公告)号：WO2013015608A3
公开(公告)日：2013-04-04
申请号：PCT/KR2012005931
申请日：2012-07-25
Applicant: YOON JONG-OH
Inventor： YOON JONG-OH
CPC classification number: C25D3/56
Abstract: The present invention provides various industrially-applicable zirconium alloy electroplating solution compositions using zirconium sulfate as a starting material. Particularly, an organic acid is used as a complexing agent, and at least one metal ion selected from the group consisting of aluminum, zinc, chromium, iron, indium, cadmium, titanium, cobalt, nickel, tin, lead, copper, silver, palladium, platinum, gold, iridium and osmium is added to a zirconium ion solution, thus easily forming an alloy layer.
Abstract translation: 本发明提供了使用硫酸锆作为原料的各种工业上适用的锆合金电镀液组合物。 特别地，使用有机酸作为络合剂，并且选自铝，锌，铬，铁，铟，镉，钛，钴，镍，锡，铅，铜，银等中的至少一种金属离子， 将钯，铂，金，铱和锇添加到锆离子溶液中，从而容易地形成合金层。
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