公开(公告)号：WO2023059401A2

公开(公告)日：2023-04-13

申请号：PCT/US2022/040258

申请日：2022-08-12

Applicant: MICROCHIP TECHNOLOGY INC.

Inventor： RAHBAR, Kamran ,  MEYER, Peter

IPC: H03K7/08 ,  H03B5/00 ,  F24C7/08 ,  H03L1/02 ,  H03L1/04 ,  H05B1/02 ,  G01R31/317 ,  F24C7/085 ,  H03L1/022 ,  H03L1/028 ,  H05B1/0263

Abstract: A timing device includes an oven having a chamber, a crystal oscillator disposed in the chamber that generates a clock signal, and one or more sensors to generate operational characteristic signals indicative of respective operational characteristics of the crystal oscillator or the oven. The timing device includes a plurality of I/O connections and an IC device. The IC device includes processing logic to generate information that indicates how the generated clock signal is to be modified and a modulator coupled to the processing logic and the crystal oscillator. The modulator modulates the generated clock signal in relation to the information to generate a modulated clock signal indicative of the one or more operational characteristics of the crystal oscillator or the oven. The modulator outputs the modulated clock signal over a single one of the plurality of I/O connections.

公开(公告)号：WO2017015834A1

公开(公告)日：2017-02-02

申请号：PCT/CN2015/085205

申请日：2015-07-27

Applicant: 广东大普通信技术有限公司

Inventor： 王义锋 ,  刘朝胜

IPC: H03L1/04

CPC classification number: H03B5/04 ,  H03B5/32 ,  H03H9/02102 ,  H03H9/19 ,  H03L1/04

Abstract: 本发明属于石英晶体振荡器技术领域，尤其涉及一种直接加热式恒温晶体振荡器。本发明在晶片的表面设置有导线，导线的两端各连接一个支撑柱位于安装空间内部的一端，支撑柱位于安装空间外部的一端连接晶体引脚，由此，通过支撑柱和晶体引脚将晶片表面的导线与外部电路连接，在外部电路中给所述导线通电流后，导线发热即可实现对晶片的加热。本发明所述的恒温晶体振荡器不需要在晶体振荡器内部装配额外的晶片加热部件，只需要在晶片的表面一次性设置导线即可完成对晶片的加热，并且由于导线直接接触地加热晶片，不会造成加热功耗的浪费，能整体上降低晶片的加热功耗。

公开(公告)号：WO2010039946A2

公开(公告)日：2010-04-08

申请号：PCT/US2009/059213

申请日：2009-10-01

Applicant: CTS CORPORATION

Inventor： STOLPMAN, James

IPC: H03L1/04

CPC classification number: H03L1/04

Abstract: An oscillator assembly includes a substrate having a top surface, a bottom surface, and a plurality of side surfaces. At least one of the side surfaces has at least one castellation which is covered with conductive material and includes a lower end spaced from the bottom surface of the substrate. The space is defined by an elongate groove in the side surface which is devoid of conductive material and extends between the lower end of the castellation and the bottom surface of the substrate to eliminate the risk of a short circuit with any of the connection pads on a customer's motherboard. The oscillator assembly further incorporates an oscillator circuit in which a current limiting resistor is located in series between the power supply and the heater control circuit.

Abstract translation: 振荡器组件包括具有顶表面，底表面和多个侧表面的衬底。 至少一个侧表面具有至少一个覆盖有导电材料的城堡形结构并且包括与基底的底表面隔开的下端。 该空间由没有导电材料并且在城堡状结构的下端和基底的底表面之间延伸的侧表面中的细长凹槽限定，以消除与任何连接垫短路的风险 客户的主板。 振荡器组件还包含一个振荡器电路，其中一个限流电阻串联在电源和加热器控制电路之间。

公开(公告)号：WO2009108324A3

公开(公告)日：2009-09-03

申请号：PCT/US2009/001204

申请日：2009-02-26

Applicant: CTS CORPORATION

Inventor： STOLPMAN, James L. ,  MCCRACKEN, Jeffrey A.

IPC: H03L1/04

Abstract: An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.

公开(公告)号：WO2008002395A3

公开(公告)日：2008-07-17

申请号：PCT/US2007013890

申请日：2007-06-13

Applicant: CTS CORP

Inventor： STOLPMAN JAMES L

IPC: H03L1/02 ,  H03L1/04

CPC classification number: H03L1/023 ,  H03L1/028

Abstract: An oscillator having improved frequency stability which includes an oscillator circuit and an SC-cut resonator connected with the oscillator circuit. The SC-cut resonator has a first turning point. A temperature compensation circuit is connected with the oscillator circuit. The temperature compensation circuit is adapted to adjust a reference frequency generated by the oscillator circuit according to a frequency response associated with a second turning point of an AT-cut resonator.

Abstract translation: 一种具有改进的频率稳定性的振荡器，其包括振荡器电路和与该振荡器电路连接的SC切割谐振器。 SC切割谐振器具有第一转折点。 温度补偿电路与振荡器电路连接。 温度补偿电路适于根据与AT切割谐振器的第二转折点相关联的频率响应来调整由振荡器电路生成的基准频率。

公开(公告)号：WO2013066939A1

公开(公告)日：2013-05-10

申请号：PCT/US2012/062688

申请日：2012-10-31

Applicant: ITRON, INC.

Inventor： CORNWALL, Mark, K. ,  CAHILL-O'BRIEN, Barry ,  PAOLINO, Joseph

IPC: H03L1/04 ,  H03L7/06 ,  H01L35/00

CPC classification number: H03L1/027 ,  H03L7/18

Abstract: The presently disclosed subject matter is directed to methods and apparatus enabling production of a stable output from a phase locked loop (PLL) circuit. A crystal controlled oscillator provides a reference signal to the PLL circuit. Temperature variations associated with the crystal cause variations in the operating frequency of the crystal that result in variations of the PLL output frequency. The presently disclosed subject matter compensates for such variations in frequency output by modifying an operation of the PLL circuit based on the temperature variations so that the output frequency remains stable even with temperature induced variations in the reference signal.

Abstract translation: 目前公开的主题涉及能够产生来自锁相环（PLL）电路的稳定输出的方法和装置。 晶振控制振荡器为PLL电路提供参考信号。 与晶体相关的温度变化导致晶体工作频率的变化，导致PLL输出频率的变化。 目前公开的主题通过基于温度变化修改PLL电路的操作来补偿频率输出中的这种变化，使得即使在参考信号中的温度引起的变化的情况下，输出频率也保持稳定。

公开(公告)号：WO2012112621A1

公开(公告)日：2012-08-23

申请号：PCT/US2012/025135

申请日：2012-02-14

Applicant: QUALCOMM INCORPORATED ,  WILCOX, Rick A. ,  FILIPOVIC, Daniel F. ,  CHI, Xu Mike ,  ROSOLOWSKI, Chris M.

Inventor： WILCOX, Rick A. ,  FILIPOVIC, Daniel F. ,  CHI, Xu Mike ,  ROSOLOWSKI, Chris M.

IPC: H03B5/04 ,  H03L1/02 ,  H03L1/04

CPC classification number: H03L1/028 ,  G01K7/22 ,  H03B5/30 ,  H03B5/36 ,  H03B5/364 ,  H03L1/027

Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.

Abstract translation: 一种装置包括在导热封装内的温度测量装置。 封装内的晶体热耦合到温度测量装置并经受与温度测量装置相同的温度。 封装外部的控制器被配置为从晶体接收信号和来自温度测量装置的温度测量。 控制器被配置为基于温度测量来估计晶体的频率误差，并且向外部系统提供频率误差估计。

公开(公告)号：WO2010039946A3

公开(公告)日：2010-05-27

申请号：PCT/US2009059213

申请日：2009-10-01

Applicant: CTS CORP

Inventor： STOLPMAN JAMES

IPC: H03L1/04

CPC classification number: H03L1/04

Abstract: An oscillator assembly includes a substrate having a top surface, a bottom surface, and a plurality of side surfaces. At least one of the side surfaces has at least one castellation which is covered with conductive material and includes a lower end spaced from the bottom surface of the substrate. The space is defined by an elongate groove in the side surface which is devoid of conductive material and extends between the lower end of the castellation and the bottom surface of the substrate to eliminate the risk of a short circuit with any of the connection pads on a customer's motherboard. The oscillator assembly further incorporates an oscillator circuit in which a current limiting resistor is located in series between the power supply and the heater control circuit.

Abstract translation: 振荡器组件包括具有顶表面，底表面和多个侧表面的基底。 侧表面中的至少一个具有至少一个被导电材料覆盖的城堡，并且包括与基底的底表面间隔开的下端。 该空间由侧表面中的细长凹槽限定，其不具有导电材料，并且在该基座的下端与基底的底表面之间延伸，以消除与一个连接垫上的任何连接垫短路的风险 客户主板。 振荡器组件还包括振荡器电路，其中限流电阻串联在电源和加热器控制电路之间。

公开(公告)号：WO2010002300A1

公开(公告)日：2010-01-07

申请号：PCT/SE2008/050816

申请日：2008-07-01

Applicant: Telefonaktiebolaget LM Ericsson (publ) ,  JANSSON, Jörgen

Inventor： JANSSON, Jörgen

IPC: H03L1/04 ,  H03B5/04 ,  H05K1/02

CPC classification number: H03L1/04 ,  H03B5/04 ,  H03B5/36 ,  H05K1/0212 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2203/165

Abstract: The present invention is directed to a crystal oscillator package comprising a current transporting structure comprising an inner conductor arrangement enclosed by an insulating material, a crystal oscillator configured to generate a signal at a predefined frequency mounted on the current transporting structure and a temperature preserving unit enclosing the crystal oscillator mounted on the current transporting structure. The inner conductor arrangement is arranged under the temperature preserving unit where the inner conductor arrangement is configured to carry a current for heating the insulating material and thereby the crystal oscillator to a temperature within a target temperature interval.

Abstract translation: 本发明涉及一种晶体振荡器封装，其包括电流传输结构，该电流传输结构包括由绝缘材料包围的内部导体布置;晶体振荡器，被配置为产生安装在当前传输结构上的预定频率的信号;以及温度保持单元， 安装在电流传输结构上的晶体振荡器。 内导体布置在温度保持单元的下方，其中内部导体布置被配置为承载用于加热绝缘材料的电流，从而使晶体振荡器承受到目标温度间隔内的温度。

公开(公告)号：WO2009029209A1

公开(公告)日：2009-03-05

申请号：PCT/US2008/009983

申请日：2008-08-22

Applicant: CTS CORPORATION

Inventor： MCCRACKEN, Jeffrey ,  KNECHT, Thomas

IPC: H03L1/04 ,  H03L1/02 ,  H03B5/04

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including a ball grid array substrate seated on a circuit board, a heater and a temperature sensor mounted on the ball grid array substrate, and a crystal package mounted to the ball grid array substrate and overlying at least the heater. A layer of thermally conductive epoxy or adhesive material couples the heater to the crystal package. Stabilizer posts, which are made of an insulative adhesive or epoxy material, are formed between the ball grid array substrate and the circuit board for stabilizing and relieving the stress on the ball grid array substrate. A lid is seated on the circuit board and covers and defines an oven for the ball grid array substrate.

Abstract translation: 包括安置在电路板上的球栅阵列基板，安装在球栅阵列基板上的加热器和温度传感器的加热振荡器封装以及安装到球栅阵列基板并至少覆盖加热器的晶体封装。 一层导热环氧树脂或粘合剂材料将加热器与晶体封装相结合。 在球栅阵列基板和电路板之间形成由绝缘粘合剂或环氧材料制成的稳定柱，用于稳定和减轻球栅阵列基板上的应力。 盖子安置在电路板上并覆盖并限定了用于球栅阵列基板的烘箱。