Invention Grant
- Patent Title: Method for manufacturing SiC epitaxial wafer by simultaneously utilizing an N-based gas and a CI-based gas, and SiC epitaxial growth apparatus
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Application No.: US15534317Application Date: 2015-12-08
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Publication No.: US10262863B2Publication Date: 2019-04-16
- Inventor: Keisuke Fukada , Masahiko Ito , Isaho Kamata , Hidekazu Tsuchida , Hideyuki Uehigashi , Hiroaki Fujibayashi , Masami Naito , Kazukuni Hara , Takahiro Kozawa , Hirofumi Aoki
- Applicant: SHOWA DENKO K.K. , CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: SHOWA DENKO K.K.,Central Research Institute Of Electric Power Industry
- Current Assignee: SHOWA DENKO K.K.,Central Research Institute Of Electric Power Industry
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-257834 20141219
- International Application: PCT/JP2015/084386 WO 20151208
- International Announcement: WO2016/098638 WO 20160623
- Main IPC: H01L21/205
- IPC: H01L21/205 ; C23C16/32 ; C30B25/14 ; C23C16/42 ; C23C16/455 ; C30B29/36 ; C30B25/18 ; C30B25/20 ; H01L21/02

Abstract:
A method for manufacturing a SiC epitaxial wafer according to one aspect of the present invention includes separately introducing, into a reaction space for SiC epitaxial growth, a basic N-based gas composed of molecules containing an N atom within the molecular structure but having neither a double bond nor a triple bond between nitrogen atoms, and a Cl-based gas composed of molecules containing a Cl atom within the molecular structure, and mixing the N-based gas and the Cl-based gas at a temperature equal to or higher than the boiling point or sublimation temperature of a solid product generated by mixing the N-based gas and the Cl-based gas.
Public/Granted literature
- US20170345658A1 METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER AND SIC EPITAXIAL GROWTH APPARATUS Public/Granted day:2017-11-30
Information query
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