Slurry for polishing of integrated circuit packaging

Invention Grant

US10319601B2 Slurry for polishing of integrated circuit packaging 有权

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Patent Title: Slurry for polishing of integrated circuit packaging
Application No.: US15467866

Application Date: 2017-03-23
Publication No.: US10319601B2

Publication Date: 2019-06-11
Inventor: Ranga Rao Arnepalli , Prerna Goradia , Prayudi Lianto , Jie Zeng , Arvind Sundarrajan , Robert Jan Visser , Guan Huei See
Applicant: Applied Materials, Inc.
Applicant Address: US CA Santa Clara
Assignee: Applied Materials, Inc.
Current Assignee: Applied Materials, Inc.
Current Assignee Address: US CA Santa Clara
Agency: Fish & Richardson P.C.
Main IPC: H01L21/3105
IPC: H01L21/3105 ; H01L21/3205 ; C09G1/02 ; C09K3/14 ; C09G1/00 ; C09G1/04 ; C09G1/06 ; C09K13/06 ; B24B1/00 ; B24B37/04 ; H01L21/306

Slurry for polishing of integrated circuit packaging

Abstract:

A slurry for chemical mechanical planarization includes water, 1-3 wt. % of abrasive particles having an average diameter of at least 10 nm and less than 100 nm and an outer surface of ceria, and ½-3 wt. % of at least one amine.

Public/Granted literature

US20180277384A1 SLURRY FOR POLISHING OF INTEGRATED CIRCUIT PACKAGING Public/Granted day:2018-09-27

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3105	......后处理