Invention Grant
- Patent Title: Printed adhesion deposition to mitigate integrated circuit delamination
-
Application No.: US15614819Application Date: 2017-06-06
-
Publication No.: US10347508B2Publication Date: 2019-07-09
- Inventor: Yong Lin , Rongwei Zhang , Benjamin Stassen Cook , Abram Castro
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/00 ; H01L23/495 ; H01L23/13 ; H01L23/15 ; H01L23/31 ; H01L23/14 ; H01L23/12 ; H01L21/60
Abstract:
A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.
Public/Granted literature
- US20170271174A1 PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINATION Public/Granted day:2017-09-21
Information query
IPC分类:
