- 专利标题： Spatially selective roughening of encapsulant to promote adhesion with functional structure
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申请号： US15462858申请日： 2017-03-19
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公开(公告)号： US10347554B2公开(公告)日： 2019-07-09
- 发明人: Norbert Joson Santos , Edward Fuergut , Sanjay Kumar Murugan
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 优先权： DE102016105243 20160321
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/00 ; H01L23/40 ; H01L23/367 ; H01L23/495 ; H01L21/56 ; H01L21/02 ; H01L21/67 ; H01L33/48 ; H01L33/54 ; H01L33/62 ; H01L33/64 ; H01L21/3105 ; H01L33/58 ; H01L33/60 ; H01L43/02 ; H01L23/24
摘要：
An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.
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