Invention Grant
- Patent Title: Spatially selective roughening of encapsulant to promote adhesion with functional structure
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Application No.: US15462858Application Date: 2017-03-19
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Publication No.: US10347554B2Publication Date: 2019-07-09
- Inventor: Norbert Joson Santos , Edward Fuergut , Sanjay Kumar Murugan
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102016105243 20160321
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/40 ; H01L23/367 ; H01L23/495 ; H01L21/56 ; H01L21/02 ; H01L21/67 ; H01L33/48 ; H01L33/54 ; H01L33/62 ; H01L33/64 ; H01L21/3105 ; H01L33/58 ; H01L33/60 ; H01L43/02 ; H01L23/24
Abstract:
An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.
Public/Granted literature
- US20170271229A1 Spatially selective roughening of encapsulant to promote adhesion with functional structure Public/Granted day:2017-09-21
Information query
IPC分类:
