Invention Grant
- Patent Title: Electronic package structure and fabrication method thereof
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Application No.: US15596113Application Date: 2017-05-16
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Publication No.: US10587041B2Publication Date: 2020-03-10
- Inventor: Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Silicon Precision Industries Co., Ltd.
- Current Assignee: Silicon Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW105131255A 20160929; TW106105039A 20170216
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01Q1/52 ; H01Q9/42 ; H01Q1/24 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L23/66 ; H01Q1/22 ; H01Q1/48
Abstract:
An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
Public/Granted literature
- US20180090835A1 ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2018-03-29
Information query
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