公开(公告)号：US10587041B2

公开(公告)日：2020-03-10

申请号：US15596113

申请日：2017-05-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01L23/552 ,  H01Q1/52 ,  H01Q9/42 ,  H01Q1/24 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/48

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US11476572B2

公开(公告)日：2022-10-18

申请号：US16750459

申请日：2020-01-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q9/42 ,  H01Q1/24 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/48

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US20200161756A1

公开(公告)日：2020-05-21

申请号：US16750459

申请日：2020-01-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q1/48 ,  H01Q1/22 ,  H01L23/66 ,  H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01Q1/24 ,  H01Q9/42

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US11437325B2

公开(公告)日：2022-09-06

申请号：US16943344

申请日：2020-07-30

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Hsiu-Fang Chien ,  Chih-Yuan Shih ,  Tsung-Li Lin

IPC: H01L23/538 ,  H01L23/528 ,  H01L23/00

Abstract: An electronic package is provided and has a packaging substrate including a ground pad and a power pad. The power pad surrounds at least three directions of the ground pad so as to increase the footprint of the power pad on the packaging substrate, thereby avoiding cracking of an electronic element disposed on the packaging substrate and effectively reducing the voltage drop.

公开(公告)号：US20210358851A1

公开(公告)日：2021-11-18

申请号：US16943344

申请日：2020-07-30

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Hsiu-Fang Chien ,  Chih-Yuan Shih ,  Tsung-Li Lin

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/528

Abstract: An electronic package is provided and has a packaging substrate including a ground pad and a power pad. The power pad surrounds at least three directions of the ground pad so as to increase the footprint of the power pad on the packaging substrate, thereby avoiding cracking of an electronic element disposed on the packaging substrate and effectively reducing the voltage drop.

公开(公告)号：US20180090835A1

公开(公告)日：2018-03-29

申请号：US15596113

申请日：2017-05-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/48 ,  H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66

CPC classification number: H01Q1/526 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H01L2924/00014

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.