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公开(公告)号：US10587041B2
公开(公告)日：2020-03-10
申请号：US15596113
申请日：2017-05-16
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01L23/552 , H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/66 , H01Q1/22 , H01Q1/48
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US10230152B2
公开(公告)日：2019-03-12
申请号：US14098490
申请日：2013-12-05
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Chien-Cheng Lin , Tsung-Hsien Tsai , Chao-Ya Yang
IPC: H01Q1/24 , H01Q1/22 , H01Q1/52 , H01L23/552
Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.
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公开(公告)号：US09997477B2
公开(公告)日：2018-06-12
申请号：US15094125
申请日：2016-04-08
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
CPC classification number: H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
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公开(公告)号：US20130320513A1
公开(公告)日：2013-12-05
申请号：US13660277
申请日：2012-10-25
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chien-Cheng Lin , Tsung-Hsien Hsu , Heng-Cheng Chu , Chao-Ya Yang , Chih-Ming Cheng
IPC: H01L23/552 , H01L21/56
CPC classification number: H01L24/27 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3128 , H01L23/552 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/16225 , H01L2224/2929 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83951 , H01L2224/92125 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2224/45099 , H01L2924/00015 , H01L2924/0781 , H01L2924/00
Abstract: A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.
Abstract translation: 提供一种半导体封装，包括：具有至少导电焊盘的衬底; 设置在所述基板上的半导体元件; 形成在半导体元件的顶表面和侧表面上并延伸到导电焊盘的导电粘合剂; 以及设置在导电粘合剂上的电子元件。 导电粘合剂和导电垫形成屏蔽结构，以防止在半导体元件和电子元件之间发生电磁干扰。
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公开(公告)号：US10587037B2
公开(公告)日：2020-03-10
申请号：US14107446
申请日：2013-12-16
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Chien-Cheng Lin , Tsung-Hsien Tsai , Chao-Ya Yang , Yude Chu
Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.
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Patent Agency Ranking
公开(公告)号：US10199731B2
公开(公告)日：2019-02-05
申请号：US15455664
申请日：2017-03-10
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Cheng-Yu Chiang
Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.
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公开(公告)号：US20170187117A1
公开(公告)日：2017-06-29
申请号：US15455664
申请日：2017-03-10
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Cheng-Yu Chiang
CPC classification number: H01Q9/0421 , H01Q1/38 , H01Q1/40
Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.
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公开(公告)号：US20150162661A1
公开(公告)日：2015-06-11
申请号：US14151184
申请日：2014-01-09
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Cheng-Yu Chiang
IPC: H01Q9/04
CPC classification number: H01Q9/0421 , H01Q1/38 , H01Q1/40
Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.
Abstract translation: 提供了一种电子部件，其包括具有相对的第一和第二表面的基板和与基板结合的天线结构。 所述天线结构具有至少第一延伸部分，设置在所述基板的第一表面上，至少第二延伸部分设置在所述基板的第二表面上，以及多个连接部分，设置在所述基板中，用于将所述第一延伸部分 部分和第二延伸部分。 连接部分中的任一相邻部分通过第一延伸部分和第二延伸部分中的一个连接。 这样，天线结构变成三维的。 本发明不需要在基板上设置用于设置天线结构的附加区域，从而减小基板的宽度以满足电子部件的小型化要求。
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公开(公告)号：US20200161756A1
公开(公告)日：2020-05-21
申请号：US16750459
申请日：2020-01-23
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01Q1/52 , H01Q1/48 , H01Q1/22 , H01L23/66 , H01L23/552 , H01L23/498 , H01L23/31 , H01L21/56 , H01Q1/24 , H01Q9/42
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US08962396B2
公开(公告)日：2015-02-24
申请号：US14086135
申请日：2013-11-21
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Ching-Hua Chen , Heng-Cheng Chu , Hsin-Lung Chung , Chih-Hsien Chiu , Chia-Yang Chen
IPC: H01L21/00 , H01L21/56 , H01L23/31 , H01L21/683 , H01L23/00
CPC classification number: H01L21/56 , H01L21/6835 , H01L23/3128 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2221/68345 , H01L2224/32225 , H01L2224/48227 , H01L2224/48237 , H01L2224/49174 , H01L2224/73265 , H01L2924/00013 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/3011 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.
Abstract translation: 一种无载体半导体封装，包括具有绝缘层和嵌入绝缘层中的电路层并具有多个导电迹线和RF（射频）迹线的电路结构，设置在该绝缘层的第一表面上的芯片，以及 电连接到导电迹线，覆盖芯片和电路层的密封剂，形成在与第一表面相对的绝缘层的第二表面上的接地层和设置在导电迹线上的多个焊球 导电迹线，其中焊球的部分电连接接地层，以便允许RF迹线和接地层形成具有RF功能的微带线，从而获得具有低成本的单层无载流子半导体封装， 简化射频设计。
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