公开(公告)号：US20220375822A1

公开(公告)日：2022-11-24

申请号：US17379289

申请日：2021-07-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Siang-Yu Lin ,  Wen-Jung Tsai ,  Chia-Yang Chen ,  Chien-Cheng Lin

IPC: H01L23/42 ,  H01L23/31 ,  H01L23/367 ,  H01L23/16 ,  H01L21/56

Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

公开(公告)号：US20220225493A1

公开(公告)日：2022-07-14

申请号：US17465335

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Chien-Cheng Lin ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H05K1/02

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

公开(公告)号：US10587041B2

公开(公告)日：2020-03-10

申请号：US15596113

申请日：2017-05-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01L23/552 ,  H01Q1/52 ,  H01Q9/42 ,  H01Q1/24 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/48

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US10230152B2

公开(公告)日：2019-03-12

申请号：US14098490

申请日：2013-12-05

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Chao-Ya Yang

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/52 ,  H01L23/552

Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.

公开(公告)号：US09997477B2

公开(公告)日：2018-06-12

申请号：US15094125

申请日：2016-04-08

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Yude Chu

IPC: H01L23/66 ,  H01L49/02 ,  H01L23/64 ,  H01L23/00 ,  H01L25/16 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/64 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/16 ,  H01L25/50 ,  H01L28/00 ,  H01L2223/6661 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.

公开(公告)号：US20130320513A1

公开(公告)日：2013-12-05

申请号：US13660277

申请日：2012-10-25

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chien-Cheng Lin ,  Tsung-Hsien Hsu ,  Heng-Cheng Chu ,  Chao-Ya Yang ,  Chih-Ming Cheng

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2924/00

Abstract: A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.

Abstract translation: 提供一种半导体封装，包括：具有至少导电焊盘的衬底; 设置在所述基板上的半导体元件; 形成在半导体元件的顶表面和侧表面上并延伸到导电焊盘的导电粘合剂; 以及设置在导电粘合剂上的电子元件。 导电粘合剂和导电垫形成屏蔽结构，以防止在半导体元件和电子元件之间发生电磁干扰。

公开(公告)号：US12057409B2

公开(公告)日：2024-08-06

申请号：US17571901

申请日：2022-01-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Chien-Cheng Lin ,  Ko-Wei Chang ,  Yu-Wei Yeh ,  Shun-Yu Chien ,  Chia-Yang Chen

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58

CPC classification number: H01L23/562 ,  H01L23/3121 ,  H01L23/49822

Abstract: An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.

公开(公告)号：US11723144B2

公开(公告)日：2023-08-08

申请号：US17465335

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Chien-Cheng Lin ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H05K1/02

CPC classification number: H05K1/0225 ,  H05K2201/10098

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

公开(公告)号：US11476572B2

公开(公告)日：2022-10-18

申请号：US16750459

申请日：2020-01-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q9/42 ,  H01Q1/24 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/48

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US09337250B2

公开(公告)日：2016-05-10

申请号：US14087554

申请日：2013-11-22

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Yude Chu

IPC: H01L49/02 ,  H01L23/64 ,  H01L23/00 ,  H01L25/16 ,  H01L25/00 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/64 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/16 ,  H01L25/50 ,  H01L28/00 ,  H01L2223/6661 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：具有多个导电焊盘的衬底和围绕形成在其表面上的导电焊盘的多个焊盘; 安装在导电焊盘上的多个无源器件; 绝缘层，其形成在所述表面上并且具有嵌入其中的无源器件的一部分; 安装在所述绝缘层的顶表面上的半导体芯片; 电连接半导体芯片和接合焊盘的多个接合线; 形成在基板的表面上以封装绝缘层，接合线和半导体芯片的密封剂，其中投射到基板上的半导体芯片的区域覆盖无源器件中最外面的一个的一部分。 因此，无源器件的安装密度提高。