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公开(公告)号：US20200161756A1
公开(公告)日：2020-05-21
申请号：US16750459
申请日：2020-01-23
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01Q1/52 , H01Q1/48 , H01Q1/22 , H01L23/66 , H01L23/552 , H01L23/498 , H01L23/31 , H01L21/56 , H01Q1/24 , H01Q9/42
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US10587041B2
公开(公告)日：2020-03-10
申请号：US15596113
申请日：2017-05-16
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01L23/552 , H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/66 , H01Q1/22 , H01Q1/48
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US11476572B2
公开(公告)日：2022-10-18
申请号：US16750459
申请日：2020-01-23
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/552 , H01L23/66 , H01Q1/22 , H01Q1/48
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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Patent Agency Ranking
公开(公告)号：US20180090835A1
公开(公告)日：2018-03-29
申请号：US15596113
申请日：2017-05-16
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC: H01Q1/52 , H01Q1/22 , H01Q1/48 , H01L23/552 , H01L23/498 , H01L23/31 , H01L21/56 , H01L23/66
CPC classification number: H01Q1/526 , H01L21/56 , H01L23/3121 , H01L23/498 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6677 , H01L2224/48091 , H01Q1/2283 , H01Q1/243 , H01Q1/48 , H01Q9/42 , H01L2924/00014
Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US20170278807A1
公开(公告)日：2017-09-28
申请号：US15181489
申请日：2016-06-14
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chi-Pin Tsai , Chi-Liang Shih , Ming-Fan Tsai , Chia-Yang Chen
IPC: H01L23/66 , H01L23/31 , H01L23/498 , H01L23/00
CPC classification number: H01L23/66 , H01L23/3121 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48101 , H01L2224/48106 , H01L2224/48195 , H01L2224/48225 , H01L2224/48227 , H01L2224/48265 , H01L2224/49171 , H01L2224/73253 , H01L2924/15192 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107
Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
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公开(公告)号：US10074621B2
公开(公告)日：2018-09-11
申请号：US15181489
申请日：2016-06-14
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chi-Pin Tsai , Chi-Liang Shih , Ming-Fan Tsai , Chia-Yang Chen
IPC: H01L23/48 , H01L23/66 , H01L23/31 , H01L23/498 , H01L23/00
CPC classification number: H01L23/66 , H01L23/3121 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48101 , H01L2224/48106 , H01L2224/48195 , H01L2224/48225 , H01L2224/48227 , H01L2224/48265 , H01L2224/49171 , H01L2224/73253 , H01L2924/00014 , H01L2924/15192 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2224/45099 , H01L2924/00012
Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
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公开(公告)号：US20160300660A1
公开(公告)日：2016-10-13
申请号：US14718126
申请日：2015-05-21
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chi-Pin Tsai , Ming-Fan Tsai , Jyun-Yuan Jhang , Chi-Liang Shih
CPC classification number: H01F27/022 , H01F17/062 , H01F2027/2814 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/15311 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
Abstract: An electronic device is provided, which includes: a magnetically conductive element having at least a through hole; a conductor structure formed on the magnetically conductive element and in the through hole; and a base body encapsulating the magnetically conductive element and the conductor structure, thereby allowing the electronic device to generate a higher magnetic flux and thus cause an increase in inductance.
Abstract translation: 提供一种电子器件，其包括：具有至少一个通孔的导磁元件; 形成在所述导磁元件和所述通孔中的导体结构; 以及基体，其密封导电元件和导体结构，从而允许电子器件产生较高的磁通量，从而引起电感的增加。
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公开(公告)号：US20150263421A1
公开(公告)日：2015-09-17
申请号：US14290121
申请日：2014-05-29
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Tsung-Hsien Tsai , Chi-Pin Tsai , Chih-Ming Cheng
CPC classification number: H01Q1/526 , H01L23/552 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/3025 , H01Q1/42 , H01Q9/42 , H01Q23/00 , Y10T29/49018 , H01L2924/00014
Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure provided on the substrate, wherein the antenna structure has at least a supporting portion and an extending portion supported by the supporting portion over the substrate and surrounding the electronic element; and a shielding structure provided on the substrate and overlapping with the antenna structure, thereby saving the surface area of the substrate so as to meet the miniaturization requirement of the electronic package.
Abstract translation: 提供电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 设置在所述基板上的天线结构，其中所述天线结构至少具有支撑部分和由所述支撑部分支撑在所述基板上并围绕所述电子元件的延伸部分; 以及设置在基板上并与天线结构重叠的屏蔽结构，从而节省了基板的表面积，以满足电子封装的小型化要求。
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