Invention Grant
- Patent Title: Hardmask composition, method of forming pattern using hardmask composition, and hardmask formed from hardmask composition
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Application No.: US15944920Application Date: 2018-04-04
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Publication No.: US11034847B2Publication Date: 2021-06-15
- Inventor: Minsu Seol , Sangwon Kim , Hyeonjin Shin , Dongwook Lee , Seongjun Park , Yunseong Lee , Seongjun Jeong , Alum Jung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2017-0089674 20170714,KR10-2018-0032717 20180321
- Main IPC: C09D7/63
- IPC: C09D7/63 ; G03F7/11 ; G03F7/09 ; G03F7/07 ; G03F7/40 ; C07F3/02 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/38 ; H01L21/311 ; H01L21/3213 ; G03F7/075
Abstract:
Provided are a hardmask composition including a structure represented by Formula 1 and a solvent, a method of forming a pattern using the hardmask composition, and a hardmask formed from the hardmask composition. wherein in Formula 1, R1 to R8, X, and M are described in detail in the detailed description.
Public/Granted literature
Information query
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