Invention Grant
- Patent Title: Method for fabricating electronic package structure
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Application No.: US16750459Application Date: 2020-01-23
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Publication No.: US11476572B2Publication Date: 2022-10-18
- Inventor: Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Hsuanyeh Law Group PC
- Priority: TW105131255 20160929,TW106105039 20170216
- Main IPC: H01Q1/52
- IPC: H01Q1/52 ; H01Q9/42 ; H01Q1/24 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L23/552 ; H01L23/66 ; H01Q1/22 ; H01Q1/48
Abstract:
An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
Public/Granted literature
- US20200161756A1 METHOD FOR FABRICATING ELECTRONIC PACKAGE STRUCTURE Public/Granted day:2020-05-21
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