- 专利标题: Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
-
申请号: US17209137申请日: 2021-03-22
-
公开(公告)号: US11745302B2公开(公告)日: 2023-09-05
- 发明人: Sivapackia Ganapathiappan , Boyi Fu , Ashwin Chockalingam , Daniel Redfield , Rajeev Bajaj , Mahendra C. Orilall , Hou T. Ng , Jason G. Fung , Mayu Yamamura
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: PATTERSON + SHERIDAN, LLP
- 主分类号: B24B37/24
- IPC分类号: B24B37/24 ; B33Y70/00 ; B24D3/28 ; B33Y10/00 ; B33Y80/00 ; C09G1/16 ; B33Y70/10 ; B29K33/04 ; B24B37/22 ; B24B37/26 ; B29C64/112 ; B24D11/00 ; B24D11/04 ; B29C35/08 ; C09D4/00
摘要:
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
公开/授权文献
信息查询