Invention Grant
- Patent Title: Memory module, main board, and server device
-
Application No.: US17383056Application Date: 2021-07-22
-
Publication No.: US12079146B2Publication Date: 2024-09-03
- Inventor: Jeonghyeon Cho , Yongsuk Kwon , Kyungsoo Kim , Jonghoon Kim , Jonghyun Seok , Jonggeon Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20200187164 2020.12.30
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G06F1/20 ; G06F1/30 ; G06F13/12 ; G06F13/16 ; G06F13/364 ; G06F13/40 ; G11C5/04 ; G11C5/06 ; G11C7/10 ; H05K1/14 ; H05K1/16 ; H05K1/18 ; H05K3/36 ; H05K7/02 ; H05K7/20

Abstract:
A memory module includes a memory substrate including a main connector and an auxiliary connector, configured to be connected to an external device; and a plurality of memory chips mounted on at least one of a first surface or a second surface of the memory substrate, wherein the main connector is disposed on one side of the memory substrate, and the auxiliary connector is disposed on the second surface of the memory substrate.
Public/Granted literature
- US20220206968A1 MEMORY MODULE, MAIN BOARD, AND SERVER DEVICE Public/Granted day:2022-06-30
Information query