- 专利标题： DIE SIDEWALL COATINGS AND RELATED METHODS
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申请号： US16879378申请日： 2020-05-20
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公开(公告)号： US20200279747A1公开(公告)日： 2020-09-03
- 发明人: Francis J. CARNEY , Yusheng LIN , Michael J. SEDDON , Chee Hiong CHEW , Soon Wei WANG , Eiji KUROSE
- 申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 申请人地址： US AZ Phoenix
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Phoenix
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/56 ; H01L23/31 ; H01L21/48 ; H01L23/12 ; H01L23/00 ; H01L21/78
摘要：
Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; applying a permanent coating material into the plurality of notches; forming a first organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.
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