- 专利标题： HEATING/COOLING DEVICE AND HEATING/COOLING METHOD
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申请号： US17754446申请日： 2020-08-06
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公开(公告)号： US20220336238A1公开(公告)日： 2022-10-20
- 发明人: Shosuke ENDO , Yohei MIDORIKAWA , Yohei NAKAGOMI , Yoshihiro KOBAYASHI , Yasuo NAKATANI , Susumu SAITO , Chanseong AHN , Yuta TAKAHASHI , Takahiro KIJIMA
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Minato-ku, Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Minato-ku, Tokyo
- 优先权： JP2019-184004 20191004
- 国际申请： PCT/JP2020/030196 WO 20200806
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/66 ; H01L21/324 ; H01L21/687
摘要：
A heating/cooling device includes: a chamber; a plurality of substrate holders provided inside the chamber to support substrates; a plurality of LED light sources provided outside the chamber to irradiate the substrates held on the substrate holders with LED light having a wavelength that heats the substrates; a plurality of transmission windows provided between the plurality of substrate holders and the plurality of LED light sources to transmit the LED light radiated from the LED light sources; and a plurality of gas distribution parts provided inside the chamber to distribute and supply a cooling gas to the substrates held on the substrate holders.
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