公开(公告)号：US20240249956A1

公开(公告)日：2024-07-25

申请号：US18566183

申请日：2022-05-26

申请人： Tokyo Electron Limited

发明人： Yohei NAKAGOMI ,  Ryo KUWAJIMA ,  Yohei MIDORIKAWA

IPC分类号： H01L21/67

CPC分类号： H01L21/67017

摘要： A substrate processing apparatus for processing a substrate, includes: an inner chamber in which the substrate is accommodated; an outer chamber provided outside the inner chamber, and a processing gas supplier configured to supply a processing gas to an interior of the inner chamber, wherein the inner chamber is configured to be detachable from the outer chamber, and the outer chamber is provided such that the outer chamber does not come into contact with the processing gas supplied to the interior of the inner chamber.

公开(公告)号：US20220336238A1

公开(公告)日：2022-10-20

申请号：US17754446

申请日：2020-08-06

申请人： Tokyo Electron Limited

发明人： Shosuke ENDO ,  Yohei MIDORIKAWA ,  Yohei NAKAGOMI ,  Yoshihiro KOBAYASHI ,  Yasuo NAKATANI ,  Susumu SAITO ,  Chanseong AHN ,  Yuta TAKAHASHI ,  Takahiro KIJIMA

IPC分类号： H01L21/67 ,  H01L21/66 ,  H01L21/324 ,  H01L21/687

摘要： A heating/cooling device includes: a chamber; a plurality of substrate holders provided inside the chamber to support substrates; a plurality of LED light sources provided outside the chamber to irradiate the substrates held on the substrate holders with LED light having a wavelength that heats the substrates; a plurality of transmission windows provided between the plurality of substrate holders and the plurality of LED light sources to transmit the LED light radiated from the LED light sources; and a plurality of gas distribution parts provided inside the chamber to distribute and supply a cooling gas to the substrates held on the substrate holders.