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公开(公告)号:US20220336238A1
公开(公告)日:2022-10-20
申请号:US17754446
申请日:2020-08-06
发明人: Shosuke ENDO , Yohei MIDORIKAWA , Yohei NAKAGOMI , Yoshihiro KOBAYASHI , Yasuo NAKATANI , Susumu SAITO , Chanseong AHN , Yuta TAKAHASHI , Takahiro KIJIMA
IPC分类号: H01L21/67 , H01L21/66 , H01L21/324 , H01L21/687
摘要: A heating/cooling device includes: a chamber; a plurality of substrate holders provided inside the chamber to support substrates; a plurality of LED light sources provided outside the chamber to irradiate the substrates held on the substrate holders with LED light having a wavelength that heats the substrates; a plurality of transmission windows provided between the plurality of substrate holders and the plurality of LED light sources to transmit the LED light radiated from the LED light sources; and a plurality of gas distribution parts provided inside the chamber to distribute and supply a cooling gas to the substrates held on the substrate holders.