公开(公告)号：US20180096866A1

公开(公告)日：2018-04-05

申请号：US15713164

申请日：2017-09-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei MIDORIKAWA

IPC: H01L21/67 ,  H01L21/311

CPC classification number: H01L21/67069 ,  H01L21/31116 ,  H01L21/67017 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67253

Abstract: A substrate processing apparatus includes processing parts performing substrate processing on target substrates, respectively, substrate mounting tables mounting the target substrates thereon in the respective processing parts, gas introducing members introducing processing gases into processing spaces, a common exhaust mechanism evacuating the processing spaces at once and further performing pressure control for the processing spaces at once, and a pressure measuring part configured to selectively monitor a pressure in any one of the plurality of processing spaces by using a pressure gauge. The pressure measuring part includes pipelines having pressure-measuring pipelines configured to connect the processing spaces to the pressure gauge and dummy pipelines configured to communicate with the processing spaces, which adjust a difference between a volume of the pipelines communicating with a monitored processing space of the processing spaces and a volume of the pipelines communicating with each of non-monitored processing spaces.

公开(公告)号：US20160027672A1

公开(公告)日：2016-01-28

申请号：US14809035

申请日：2015-07-24

Applicant: Tokyo Electron Limited

Inventor： Yuji ASAKAWA ,  Yohei MIDORIKAWA ,  Satoshi TODA ,  Hiroyuki TAKAHASHI

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67126 ,  H01L21/31116 ,  H01L21/6719 ,  H01L21/68742 ,  H01L21/68771 ,  H01L21/68785 ,  H01L21/68792

Abstract: A substrate processing apparatus performs a predetermined process on a substrate by using a processing gas under a vacuum atmosphere. The substrate processing apparatus includes a chamber configured to accommodate the substrate and to be kept in the vacuum atmosphere; a substrate mounting table configured to mount the substrate thereon in the chamber; a gas introduction member configured to introduce a gas including the processing gas in the chamber; a partition wall member provided to be movable up and down in the chamber and configured to form a partition wall that defines a processing space in a region including the substrate above the substrate mounting table; and an elevating mechanism configured to move the partition wall member up and down.

Abstract translation: 基板处理装置在真空气氛下使用处理气体在基板上进行规定的处理。 基板处理装置包括：腔室，被配置为容纳基板并保持在真空气氛中; 基板安装台，其构造成将所述基板安装在所述室中; 气体引入构件，被配置为将包括处理气体的气体引入所述腔室; 分隔壁构件，设置成可在所述室中上下移动并且构造成在所述基板安装台上方包括所述基板的区域中形成限定处理空间的分隔壁; 以及升降机构，其构造成使所述隔壁构件上下移动。

公开(公告)号：US20240249956A1

公开(公告)日：2024-07-25

申请号：US18566183

申请日：2022-05-26

Applicant: Tokyo Electron Limited

Inventor： Yohei NAKAGOMI ,  Ryo KUWAJIMA ,  Yohei MIDORIKAWA

IPC: H01L21/67

CPC classification number: H01L21/67017

Abstract: A substrate processing apparatus for processing a substrate, includes: an inner chamber in which the substrate is accommodated; an outer chamber provided outside the inner chamber, and a processing gas supplier configured to supply a processing gas to an interior of the inner chamber, wherein the inner chamber is configured to be detachable from the outer chamber, and the outer chamber is provided such that the outer chamber does not come into contact with the processing gas supplied to the interior of the inner chamber.

公开(公告)号：US20220336238A1

公开(公告)日：2022-10-20

申请号：US17754446

申请日：2020-08-06

Applicant: Tokyo Electron Limited

Inventor： Shosuke ENDO ,  Yohei MIDORIKAWA ,  Yohei NAKAGOMI ,  Yoshihiro KOBAYASHI ,  Yasuo NAKATANI ,  Susumu SAITO ,  Chanseong AHN ,  Yuta TAKAHASHI ,  Takahiro KIJIMA

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/324 ,  H01L21/687

Abstract: A heating/cooling device includes: a chamber; a plurality of substrate holders provided inside the chamber to support substrates; a plurality of LED light sources provided outside the chamber to irradiate the substrates held on the substrate holders with LED light having a wavelength that heats the substrates; a plurality of transmission windows provided between the plurality of substrate holders and the plurality of LED light sources to transmit the LED light radiated from the LED light sources; and a plurality of gas distribution parts provided inside the chamber to distribute and supply a cooling gas to the substrates held on the substrate holders.