公开(公告)号：US20200048134A1

公开(公告)日：2020-02-13

申请号：US16529148

申请日：2019-08-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Reiko SASAHARA ,  Yasuo NAKATANI ,  Keiko HADA

IPC: C03B19/14

Abstract: There is provided a method of processing an oxygen-containing workpiece. The method of processing an oxygen-containing workpiece includes controlling a fluorine concentration in the oxygen-containing workpiece based on at least one of a kind of a fluorine-containing processing gas, a processing temperature and a processing pressure used for processing the oxygen-containing workpiece.

公开(公告)号：US20220336238A1

公开(公告)日：2022-10-20

申请号：US17754446

申请日：2020-08-06

Applicant: Tokyo Electron Limited

Inventor： Shosuke ENDO ,  Yohei MIDORIKAWA ,  Yohei NAKAGOMI ,  Yoshihiro KOBAYASHI ,  Yasuo NAKATANI ,  Susumu SAITO ,  Chanseong AHN ,  Yuta TAKAHASHI ,  Takahiro KIJIMA

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/324 ,  H01L21/687

Abstract: A heating/cooling device includes: a chamber; a plurality of substrate holders provided inside the chamber to support substrates; a plurality of LED light sources provided outside the chamber to irradiate the substrates held on the substrate holders with LED light having a wavelength that heats the substrates; a plurality of transmission windows provided between the plurality of substrate holders and the plurality of LED light sources to transmit the LED light radiated from the LED light sources; and a plurality of gas distribution parts provided inside the chamber to distribute and supply a cooling gas to the substrates held on the substrate holders.