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公开(公告)号:US20240105422A1
公开(公告)日:2024-03-28
申请号:US18475502
申请日:2023-09-27
Applicant: Tokyo Electron Limited
Inventor: Masato OZAWA , Chanseong AHN , Masaki TSUNODA
IPC: H01J37/32
CPC classification number: H01J37/3211
Abstract: A plasma processing apparatus includes: a processing container; a stage arranged inside the processing container to place a substrate to be processed on the stage; a plasma excitation antenna arranged above the processing container; a coil holder for holding the plasma excitation antenna; and a radio-frequency power supply for supplying radio-frequency power to the plasma excitation antenna. The coil holder includes a plurality of beam-like members arranged radially to protrude outward from a center of the coil holder, and a clamp-like member attached to each of the plurality of beam-like members and suspended downward from each of the plurality of beam-like members. The clamp-like member has an upper end supported by each beam-like member with a screw member and is configured to move in a pendulum manner, and a gripper configured to grip and hold the plasma excitation antenna is formed in a lower end of the clamp-like member.
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公开(公告)号:US20220336238A1
公开(公告)日:2022-10-20
申请号:US17754446
申请日:2020-08-06
Applicant: Tokyo Electron Limited
Inventor: Shosuke ENDO , Yohei MIDORIKAWA , Yohei NAKAGOMI , Yoshihiro KOBAYASHI , Yasuo NAKATANI , Susumu SAITO , Chanseong AHN , Yuta TAKAHASHI , Takahiro KIJIMA
IPC: H01L21/67 , H01L21/66 , H01L21/324 , H01L21/687
Abstract: A heating/cooling device includes: a chamber; a plurality of substrate holders provided inside the chamber to support substrates; a plurality of LED light sources provided outside the chamber to irradiate the substrates held on the substrate holders with LED light having a wavelength that heats the substrates; a plurality of transmission windows provided between the plurality of substrate holders and the plurality of LED light sources to transmit the LED light radiated from the LED light sources; and a plurality of gas distribution parts provided inside the chamber to distribute and supply a cooling gas to the substrates held on the substrate holders.
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