- 专利标题： THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
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申请号： US17891738申请日： 2022-08-19
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公开(公告)号： US20240063089A1公开(公告)日： 2024-02-22
- 发明人: Adel Elsherbini , Wenhao Li , Bhaskar Jyoti Krishnatreya , Debendra Mallik , Krishna Vasanth Valavala , Lei Jiang , Yoshihiro Tomita , Omkar Karhade , Haris Khan Niazi , Tushar Talukdar , Mohammad Enamul Kabir , Xavier Brun , Feras Eid
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/46
- IPC分类号： H01L23/46
摘要：
Microelectronic devices, assemblies, and systems include a multichip composite device having one or more integrated circuit dies bonded to a base die and an inorganic dielectric material adjacent the integrated circuit dies and over the base die. The multichip composite device includes a dummy die, dummy vias, or integrated fluidic cooling channels laterally adjacent the integrated circuit dies to conduct heat from the base die.
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