Invention Publication
- Patent Title: PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
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Application No.: US18513015Application Date: 2023-11-17
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Publication No.: US20240088052A1Publication Date: 2024-03-14
- Inventor: Bai NIE , Gang DUAN , Srinivas PIETAMBARAM , Jesse JONES , Yosuke KANAOKA , Hongxia FENG , Dingying XU , Rahul MANEPALLI , Sameer PAITAL , Kristof DARMAWIKARTA , Yonggang LI , Meizi JIAO , Chong ZHANG , Matthew TINGEY , Jung Kyu HAN , Haobo CHEN
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- The original application number of the division: US16366661 2019.03.27
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/31
Abstract:
A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.
Information query
IPC分类:
