- 专利标题： ELECTRICAL LAYER WITH ROUGHENED SURFACES
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申请号： US18091188申请日： 2022-12-29
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公开(公告)号： US20240222136A1公开(公告)日： 2024-07-04
- 发明人: Bohan Shan , Haobo Chen , Srinivas Venkata Ramanuja Pietambaram , Hongxia Feng , Gang Duan , Xiaoying Guo , Ashay A. Dani , Yiqun Bai , Dingying Xu , Bai Nie , Kyle Jordan Arrington , Wei Wei , Ziyin Lin
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L21/321
- IPC分类号： H01L21/321 ; H01L21/3065 ; H01L21/311 ; H01L21/768
摘要：
Mechanical or chemical processes can form roughened surfaces which can be used for coupling layers of electrical systems such as when forming dies, substrates, computer chips or the like that, when subjected to high stress, are robust enough to remain coupled together.
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