发明授权
US5976260A Semiconductor producing apparatus, and wafer vacuum chucking device, gas
cleaning method and nitride film forming method in semiconductor
producing apparatus
失效
半导体制造装置，晶片真空夹紧装置，半导体制造装置中的气体净化方法和氮化物膜形成方法
- 专利标题： Semiconductor producing apparatus, and wafer vacuum chucking device, gas cleaning method and nitride film forming method in semiconductor producing apparatus
- 专利标题（中）： 半导体制造装置，晶片真空夹紧装置，半导体制造装置中的气体净化方法和氮化物膜形成方法
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申请号： US612445申请日： 1996-03-07
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公开(公告)号： US5976260A公开(公告)日： 1999-11-02
- 发明人: Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
- 申请人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX4-238313 19920907; JPX4-346456 19921225; JPX5-197561 19930809
- 主分类号： B23Q3/08
- IPC分类号： B23Q3/08 ; B25B11/00 ; C23C16/34 ; C23C16/44 ; C23C16/455 ; C23C16/458 ; C23C16/48 ; H01L21/683 ; C23C16/00
摘要：
It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer (1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
公开/授权文献
- US5195578A Method of and an apparatus for trickling film heat exchange 公开/授权日：1993-03-23
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