发明授权
- 专利标题: High-frequency sputtering device
- 专利标题(中): 高频溅射装置
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申请号: US12727316申请日: 2010-03-19
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公开(公告)号: US09017535B2公开(公告)日: 2015-04-28
- 发明人: Yoshinori Nagamine , Kanto Nakamura , Koji Tsunekawa
- 申请人: Yoshinori Nagamine , Kanto Nakamura , Koji Tsunekawa
- 申请人地址: JP Kawasaki-shi
- 专利权人: Canon Anelva Corporation
- 当前专利权人: Canon Anelva Corporation
- 当前专利权人地址: JP Kawasaki-shi
- 代理机构: Fitzpatrick, Cella, Harper & Scinto
- 优先权: WOPCTJP/2007/069459 20071004; JP2008-215386 20080825
- 主分类号: C23C14/00
- IPC分类号: C23C14/00 ; C25B9/00 ; C25B11/00 ; C25B13/00 ; C23C16/00 ; C23C14/50 ; C23C16/458 ; C23C14/35 ; H01J37/34 ; C23C14/08 ; C23C14/22 ; C23C14/34 ; H01L43/12
摘要:
Provided is a high-quality magnetoresistive thin film by using a method of controlling self bias of a high-frequency sputtering device. In order to control the self bias for the substrate by adjusting a substrate potential, the high-frequency sputtering device according to the present invention includes: a chamber; evacuation means for evacuating the inside of the chamber; gas introduction means for supplying a gas into the chamber; a substrate holder provided with a substrate mounting table; rotation drive means capable of rotating the substrate holder; a sputtering cathode provided with a target mounting table and arranged such that the surface of the target mounting table is non-parallel to the surface of the substrate mounting table; an electrode disposed inside the substrate holder; and a variable impedance mechanism electrically connected to the electrode, for adjusting the substrate potential on the substrate holder.
公开/授权文献
- US20100213047A1 HIGH-FREQUENCY SPUTTERING DEVICE 公开/授权日:2010-08-26
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