Invention Grant
- Patent Title: Panel with releasable core
- Patent Title (中): 面板带可释放芯
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Application No.: US14227723Application Date: 2014-03-27
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Publication No.: US09554472B2Publication Date: 2017-01-24
- Inventor: Ching-Ping Janet Shen , Ravi Shankar , Yonggang Li , Dilan Seneviratne , Charan K. Gurumurthy
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/02 ; H05K3/10 ; H05K1/18 ; B23K1/00 ; B32B7/12 ; B32B15/08 ; B32B15/20 ; B32B27/08 ; B32B27/28 ; B32B27/38 ; H05K3/02 ; H05K3/38 ; H05K3/28

Abstract:
Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.
Public/Granted literature
- US20150181717A1 PANEL WITH RELEASABLE CORE Public/Granted day:2015-06-25
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