Invention Grant
- Patent Title: Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
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Application No.: US14236343Application Date: 2012-07-30
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Publication No.: US09676969B2Publication Date: 2017-06-13
- Inventor: Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Takaaki Noudou , Maki Inada , Kyoko Kuroda
- Applicant: Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Takaaki Noudou , Maki Inada , Kyoko Kuroda
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JP2011-170083 20110803
- International Application: PCT/JP2012/069376 WO 20120730
- International Announcement: WO2013/018777 WO 20130207
- Main IPC: H01B1/00
- IPC: H01B1/00 ; B05D5/12 ; C09J9/00 ; C09J9/02 ; C09J11/04 ; H01B1/22 ; H05K3/38 ; C09J7/02 ; H01B13/00 ; H05K3/10 ; H05K1/09 ; H05K3/12 ; H05K1/03 ; C08K3/08 ; C08K3/22 ; C08K7/18
Abstract:
The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.
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