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公开(公告)号:CN104617055A
公开(公告)日:2015-05-13
申请号:CN201410755931.2
申请日:2014-09-03
申请人: 罗门哈斯电子材料有限公司
CPC分类号: H01L23/295 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2250/24 , B32B2264/10 , B32B2307/748 , B32B2457/00 , H01L21/563 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/27436 , H01L2224/29005 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/29387 , H01L2224/29388 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/83207 , H01L2224/9211 , H01L2924/12042 , Y10T428/31504 , Y10T428/31551 , Y10T428/31721 , Y10T428/31725 , Y10T428/31786 , H01L2924/207 , H01L2924/206 , H01L2924/00014 , H01L2924/00 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2224/81 , H01L2224/83
摘要: 用作为预施加的底部填充材料的底部填充结构包含具有第一聚合物区域和第二聚合物区域的聚合物层,其中,所述第二聚合物区域包含无机填料。包含芯片或模具和基片的电子组件使用这样的多层结构的预施加的底部填充来形成。