LEAD-FREE THICK FILM PASTE COMPOSITION
    8.
    发明授权
    LEAD-FREE THICK FILM PASTE COMPOSITION 失效
    无铅厚膜浆料组合

    公开(公告)号:EP0711255B1

    公开(公告)日:1997-10-22

    申请号:EP94923960.2

    申请日:1994-07-26

    CPC分类号: C03C8/16 C03C8/02 H01B1/16

    摘要: A screen-printable thick film paste composition suitable for forming conductive patterns on a rigid substrate comprising: (a) finely divided particles of a lead-free glass composition having a softening point log (eta) = 7.6 poise from 400C-650C, a log (eta) specific viscosity in a range from 2 at 500C to 5 at 700C and consisting essentially of, by weight 65-95 % Bi2O3, 2-15 % SiO2, 0.1-9 % B2O3, 0-5 % Al2O3, 0-5 % CaO, and 0-20 % ZnO; and (b) electrically conductive particles; and all of (a) and (b) being dispersed in (c) an organic medium.