-
公开(公告)号：EP3381690A1
公开(公告)日：2018-10-03
申请号：EP17187830.9
申请日：2017-08-24
CPC分类号： B41J2/14 , B05B1/02 , B41J2/055 , B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2002/14346 , B41J2002/14403 , B41J2002/14419
摘要： Ejection device (150) for fluid (6), comprising a solid body including: first semiconductor body (80, 100) including a chamber (130) for containing the fluid (6), an ejection nozzle (121) in fluid connection with the chamber (130), and an actuator (91) operatively connected to the chamber (130) to generate, in use, one or more pressure waves in the fluid (6) such as to cause ejection of the fluid (6) from the ejection nozzle (121); and a second semiconductor body (30) including a channel (123, 41, 48a) for feeding the fluid (6) to the chamber (130), coupled to the first semiconductor body (80, 100), in such a way that the channel (123, 41, 48a) is in fluid connection with the chamber (130). The second semiconductor body (30) integrates a damping cavity (40) over which extends a damping membrane (35), the damping cavity and the damping membrane extending laterally to the channel (48a) for feeding the fluid.
-
2.发明公开
公开(公告)号：EP3599217A1
公开(公告)日：2020-01-29
申请号：EP19187949.3
申请日：2019-07-23
发明人： QUAGLIA, Fabio , FERRERA, Marco , DEL SARTO, Marco
IPC分类号： B81C1/00
摘要： A process for manufacturing MEMS devices (101), including the step of forming a first assembly (74), which comprises: a dielectric region (122); a redistribution region (128); and a plurality of unit portions (76). Each unit portion (76) of the first assembly (74) includes: a die (2, 4), arranged in the dielectric region; and a plurality of first and second connection elements (18, 20), which give out onto opposite faces of the redistribution region (128) and are connected together by means of paths (30, 32) that extend in the redistribution region (128), the first connection elements (18, 20) being coupled to the die (2, 4). The process further includes the steps of: forming a second assembly (80; 110), which comprises a plurality of respective unit portions (84; 284), each of which includes a semiconductor portion (82; 282) and third connection elements (36, 50); mechanically coupling the first and second assemblies (74, 80; 74, 110) so as to connect the third connection elements (36, 50) to corresponding second connection elements (34); and then removing at least part of the semiconductor portion (82; 282) of each unit portion (84; 284) of the second assembly (80; 110), thus forming corresponding membranes (40).
-
公开(公告)号：EP4378883A1
公开(公告)日：2024-06-05
申请号：EP23207483.1
申请日：2023-11-02
发明人： GIUSTI, Domenico , QUAGLIA, Fabio , FERRERA, Marco , PRELINI, Carlo Luigi , SAVOIA, Alessandro Stuart
IPC分类号： B81C1/00
CPC分类号： B81C1/00238 , B81C2203/079220130101
摘要： MEMS device (1) comprising: a signal processing assembly (120); a transduction module (38; 40, 41, 56) comprising a plurality of transducer devices (56); a stiffening structure (113) at least partially surrounding each transducer device (56); one or more coupling pillars (36) for each transducer device (56), extending on the stiffening structure (113) and configured to physically and electrically couple the transduction module (38; 40, 41, 56) to the signal processing assembly (120), to carry control signals of the transducer devices (56). Each conductive coupling element (36) has a section having a shape such as to maximize the overlapping surface with the stiffening structure (113) around the respective transducer device (56). This shape includes hypocycloid with a number of cusps equal to or greater than three; triangular; quadrangular.
-
公开(公告)号：EP4183490A1
公开(公告)日：2023-05-24
申请号：EP22206037.8
申请日：2022-11-08
IPC分类号： B06B1/06
摘要： MEMS ultrasonic transducer, MUT, device (1), comprising a semiconductor body (3) with a first (3A) and a second (3B) main surface and including: a first chamber (15) extending into the semiconductor body (3) at a distance from the first main surface (3A); a membrane (18) formed by the semiconductor body (3) between the first main surface (3A) and the first chamber (15); a piezoelectric element (19) on the membrane (18); a second chamber (20) extending into the semiconductor body (3) between the first chamber (15) and the second main surface (3B); a central fluidic passage (22) extending into the semiconductor body (3) from the second main surface (3B) to the first chamber (15) and traversing the second chamber (20); and one or more lateral fluidic passages (21) extending into the semiconductor body (3) from the second main surface (3B) to the second chamber (20). The one or more lateral fluidic passages (21), the central fluidic passage (22) and the second chamber (20) define a fluidic recirculation path that fluidically connects the first chamber (15) with the outside of the semiconductor body (3).
-
5.发明公开
公开(公告)号：EP3477715A1
公开(公告)日：2019-05-01
申请号：EP18203888.5
申请日：2018-10-31
发明人： PACI, Dario , FERRERA, Marco , PICCO, Andrea
IPC分类号： H01L41/09 , H01L41/22 , H01L41/053 , H03H3/007
摘要： A MEMS device (70) comprising a body (72), having a first surface (72A) and a second surface (72B); a diaphragm cavity (74) in the body (72) extending from the second surface (72B) of the body (72); a deformable portion (77) in the body (72) between the first surface (72A) and the diaphragm cavity; and a piezoelectric actuator (90), extending on the first surface (72A) of the body (72), over the deformable portion (77). The MEMS device (70) further comprises a recess structure (78) extending in the body (72) and delimiting, in the body (72), a flexible stopper portion (72C) for the deformable portion (77), the flexible stopper portion (72C) being arranged between the deformable portion (77) and the recess structure (78).
-
6.发明公开
公开(公告)号：EP4283272A1
公开(公告)日：2023-11-29
申请号：EP23172036.8
申请日：2023-05-08
发明人： GIUSTI, Domenico , QUAGLIA, Fabio , FERRERA, Marco
摘要： Micromachined pressure transducer including: a fixed body (5) of semiconductor material, which laterally delimits a main cavity (7); a transduction structure (6), which is suspended on the main cavity (7) and includes at least a pair of deformable structures (10) and a movable region (8), which is formed by semiconductor material and is mechanically coupled to the fixed body (5) through the deformable structures (10). Each deformable structure (10) includes: a support structure (15) of semiconductor material, which includes a first and a second beam (20,22), each of which has ends fixed respectively to the fixed body (5) and to the movable region (8), the first beam (20) being superimposed, at a distance, on the second beam (22); and at least one piezoelectric transduction structure (12,14), mechanically coupled to the first beam (20). The piezoelectric transduction structures (12,14) are electrically controllable so that they cause corresponding deformations of the respective support structures (15) and a consequent translation of the movable region (8) along a translation direction (H).
-
公开(公告)号：EP3907178A1
公开(公告)日：2021-11-10
申请号：EP21171642.8
申请日：2021-04-30
发明人： GIUSTI, Domenico , PRELINI, Carlo Luigi , FERRERA, Marco , LAZZARI, Carla Maria , SEGHIZZI, Luca , BONI, Nicolò , CARMINATI, Roberto , QUAGLIA, Fabio
IPC分类号： B81B7/00
摘要： The MEMS actuator (150) is formed by a substrate (50'), which surrounds a cavity (100); by a deformable structure (105) suspended on the cavity; by an actuation structure (65) formed by a first piezoelectric region (61) of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure (90) formed by a second piezoelectric region (80) of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.
-
公开(公告)号：EP3907177A1
公开(公告)日：2021-11-10
申请号：EP21171635.2
申请日：2021-04-30
摘要： The MEMS actuator (50) is formed by a body (51), which surrounds a cavity (52) and by a deformable structure (54), which is suspended on the cavity and is formed by a movable portion (56) and by a plurality of deformable elements (55). The deformable elements are arranged consecutively to each other, connect the movable portion to the body and are each subject to a deformation. The MEMS actuator (50) further comprises at least one plurality of actuation structures (80A, 80B), which are supported by the deformable elements (55) and are configured to cause a translation of the movable portion greater than the deformation of each deformable element (55). The actuation structures each have a respective first piezoelectric region (82).
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.013 秒)
