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    CUTTING METHOD FOR STRENGTHENED GLASS PLATE
    2.
    发明公开
    CUTTING METHOD FOR STRENGTHENED GLASS PLATE 审中-公开
    SCHNEIDEVERFAHRENFÜREINEVERSTÄRKTEGLASPLATTE

    公开(公告)号：EP2664591A1

    公开(公告)日：2013-11-20

    申请号：EP12733997.6

    申请日：2012-01-11

    申请人： Asahi Glass Company, Limited

    发明人： SAITO, Isao ,  KOIKE, Akio ,  IWANAGA, Yasunari ,  KOBAYASHI, Yusuke ,  IWASAKI, Tatsuya

    IPC分类号： C03B33/09 ,  B23K26/00 ,  B23K26/14 ,  B23K26/38

    CPC分类号： C03B33/091 ,  B23K26/0057 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/40 ,  B23K2201/006 ,  B23K2203/172 ,  C03B33/07

    摘要： A method of cutting a strengthened glass plate includes irradiating a laser beam 20 on a front surface 12 of a strengthened glass plate 10 and moving an irradiation area 22 of the laser beam 20 on the front surface 12 of the strengthened glass plate 10. The laser beam has a wavelength from 800 to 1100 nm and 70.00% to 99.8% of the laser beam 20 injected into the front surface 12 of the strengthened glass plate 10 is transmitted. Further, the strengthened glass plate 10 is cut by heating an intermediate layer 17 at the irradiation area 22 at a temperature less than or equal to an annealing point while moving the irradiation area 22 of the laser beam 20 at a speed greater than or equal to 1.0 mm / sec so that a crack that penetrates the strengthened glass plate 10 in the thickness direction follows the irradiation area 22.

    摘要翻译： 切割强化玻璃板的方法包括将激光束20照射在强化玻璃板10的前表面12上，并将激光束20的照射区域22移动到加强玻璃板10的前表面12上。激光 光束具有800至1100nm的波长，并且透射注入到强化玻璃板10的前表面12中的激光束20的70.00％至99.8％。 此外，通过在小于或等于退火点的温度下加热照射区域22处的中间层17，同时以大于或等于的速度移动激光束20的照射区域22来切割加强玻璃板10 1.0mm / sec，使得沿着厚度方向穿透加强玻璃板10的裂纹跟随照射区域22。

    SUBSTRATE PROCESSING METHOD
    3.
    发明公开
    SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理

    公开(公告)号：EP2599583A1

    公开(公告)日：2013-06-05

    申请号：EP11812316.5

    申请日：2011-07-19

    申请人： Hamamatsu Photonics K.K.

    发明人： SHIMOI, Hideki ,  ARAKI, Keisuke

    IPC分类号： B23K26/38 ,  B23K26/00 ,  B23K26/04 ,  H01L21/306

    CPC分类号： B23K26/064 ,  B23K26/0006 ,  B23K26/0736 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/30608 ,  H01L21/76898

    摘要： A substrate processing method for forming a space extending along a predetermined line in a silicon substrate includes a first step of converging a laser light which is an elliptically-polarized light having an ellipticity other than 1 at the substrate so as to form a plurality of modified spots within the substrate along the line and construct a modified region including the modified spots, and a second step of anisotropically etching the substrate so as to advance an etching selectively along the modified region and form the space in the substrate. In the first step, the light is converged at the substrate such that a moving direction of the light with respect to the substrate and a direction of polarization of the light form an angle of less than 45° therebetween, and the modified spots are made align in a plurality of rows along the line.

    SUBSTRATE PROCESSING METHOD
    4.
    发明公开
    SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理方法

    公开(公告)号：EP2599582A1

    公开(公告)日：2013-06-05

    申请号：EP11812314.0

    申请日：2011-07-19

    申请人： Hamamatsu Photonics K.K.

    发明人： SHIMOI Hideki ,  ARAKI Keisuke

    IPC分类号： B23K26/38 ,  B23K26/00 ,  B23K26/04 ,  H01L21/306

    CPC分类号： B23K26/40 ,  B23K26/0006 ,  B23K26/064 ,  B23K26/0736 ,  B23K26/382 ,  B23K26/384 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/30608 ,  H01L21/76898

    摘要： A substrate processing method for forming a space extending along a predetermined line in a silicon substrate includes a first step of converging a laser light which is an elliptically-polarized light having an ellipticity other than 1 at the substrate so as to form a plurality of modified spots within the substrate along the line and produce a modified region including the modified spots, and a second step of anisotropically etching the substrate so as to advance an etching selectively along the modified region and form the space in the substrate. In the first step, the light is converged at the substrate such that a moving direction of the light with respect to the substrate and a direction of polarization of the light form an angle of 45° or greater therebetween, and the modified spots are made align in one row along the line.

    摘要翻译： 一种用于在硅基板上形成沿着预定线延伸的空间的基板处理方法，包括：第一步，在基板上会聚作为具有除1以外的椭圆率的椭圆偏振光的激光，以形成多个修改 沿衬底在衬底内产生斑点并产生包括改性斑点的改性区域;以及第二步骤，各向异性地蚀刻衬底以便沿着改性区域选择性地推进蚀刻并在衬底中形成空间。 在第一步骤中，光会聚在基板上，使得光相对于基板的移动方向和光的偏振方向之间形成45°或更大的角度，并且使改质点对准 在一行中。

    Laser irradiation apparatus having a cylindrical lens group with external masked lenses
    8.
    发明公开
    Laser irradiation apparatus having a cylindrical lens group with external masked lenses 有权
    Laserbestrahlungsvorrichtung bestehend aus zylindrischer Linsengruppe mitäusserenMaskenlinsen

    公开(公告)号：EP1724048A2

    公开(公告)日：2006-11-22

    申请号：EP06014760.0

    申请日：2000-01-13

    申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    发明人： Tanaka, Koichiro

    IPC分类号： B23K26/06 ,  B23K26/073 ,  B23K26/067 ,  G02B27/09

    CPC分类号： G02B27/0961 ,  B23K26/0604 ,  B23K26/0608 ,  B23K26/066 ,  B23K26/067 ,  B23K26/073 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/0738 ,  G02B27/0905 ,  G02B27/0966

    摘要： An object of the present application is to obtain an even energy distribution of a laser beam in one direction, thereby conducting a uniform laser annealing on a film.
    This is achieved by providing a laser irradiation apparatus comprising: a lens (703) for dividing a laser beam (701) in one direction; and an optical system (704) for overlapping the divided laser beam, wherein the shape of the laser beam (701) entering into the lens (703) has edges vertical to the above-mentioned direction either by providing a shielded lens (703) or by providing a lens (703) narrower than the laser beam (701) before dividing.

    摘要翻译： 本申请的目的是获得激光束在一个方向上的均匀能量分布，从而对膜进行均匀的激光退火。 这通过提供一种激光照射装置来实现，所述激光照射装置包括：用于在一个方向上分割激光束（701）的透镜（703） 以及用于重叠分割的激光束的光学系统（704），其中进入透镜（703）的激光束（701）的形状具有垂直于上述方向的边缘，或者通过提供屏蔽透镜（703）或 通过在分割之前提供比激光束（701）窄的透镜（703）。

    LASER-BASED SYSTEM FOR MEMORY LINK PROCESSING WITH PICOSECOND LASERS
    9.
    发明公开
    LASER-BASED SYSTEM FOR MEMORY LINK PROCESSING WITH PICOSECOND LASERS 审中-公开
    澳大利亚激光基础系统FÜRSPEICHERVERBINDUNGSBEARBEITUNG MIT PIKOSEKUNDENLASERN

    公开(公告)号：EP1689554A2

    公开(公告)日：2006-08-16

    申请号：EP04794131.5

    申请日：2004-10-05

    申请人： GSI Lumonics Corporation

    发明人： GU, Bo ,  SMART, Donald, V. ,  CORDINGLEY, James, J. ,  LEE, Joohan ,  SVETKOFF, Donald, J. ,  JOHNSON, Shepard, D. ,  EHRMANN, Jonathan, S.

    IPC分类号： B23K26/36

    CPC分类号： H01S3/2383 ,  B23K26/04 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/0736 ,  B23K26/361 ,  B23K26/389 ,  B23K26/40 ,  B23K2201/38 ,  B23K2201/40 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/172 ,  H01L21/485 ,  H01L21/76894 ,  H01L22/12 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/0085 ,  H01S3/06758 ,  H01S3/1618 ,  H01S3/23 ,  H05K3/0026 ,  H01L2924/00

    摘要： A laser-based system for processing target material within a microscopic region without causing undesirable changes in electrical or physical characteristics of at least one material surrounding the target material, the system includes a seed laser, an optical amplifier, and a beam delivery system. The seed laser for generating a sequence of laser pulses having a first pre-determined wavelength. The optical amplifier for amplifying at least a portion of the sequence of pulses to obtain an amplified sequence of output pulses. The beam delivery system for delivering and focusing at least one pulse of the amplified sequence of pulses onto the target material. The at least one output pulse having a pulse duration in the range of about (10) picoseconds to less than (1) nanosecond. The pulse duration being within a thermal processing range. The at least one focused output pulse having sufficient power density at a location within the target material to reduce the reflectivity of the target material and efficiently couple the focused output into the target material to remove the target material.

    摘要翻译： 一种用于在微观区域内处理目标材料而不引起围绕靶材料的至少一种材料的电学或物理特性的不希望的变化的基于激光的系统，该系统包括种子激光器，光放大器和光束传递系统。 用于产生具有第一预定波长的激光脉冲序列的种子激光器。 用于放大脉冲序列的至少一部分以获得放大的输出脉冲序列的光放大器。 用于将放大的脉冲序列的至少一个脉冲传送和聚焦到目标材料上的光束传送系统。 所述至少一个输出脉冲具有在约10皮秒至小于1纳秒范围内的脉冲持续时间。 脉冲持续时间在热处理范围内。 所述至少一个聚焦输出脉冲在目标材料内的位置处具有足够的功率密度，以减少目标材料的反射率并有效地将聚焦的输出耦合到目标材料中以去除目标材料。