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11.发明公开SENSORELEMENT UND TRÄGERELEMENT ZUR HERSTELLUNG EINES SENSORS 有权传感器感应器ZUR HERSTELLUNG EINES SENSORS
公开(公告)号：EP2338034A2
公开(公告)日：2011-06-29
申请号：EP09783642.3
申请日：2009-10-01
发明人： DE VOLDER, Edmond , HUBER, Dietmar , CARRAS, Andreas , SCHILLINGER, Jakob , WATZLAWIK, Martin , BIEBRICHER, Lothar
CPC分类号： B29C45/14065 , B29C33/126 , B29C45/14655 , B29C45/1671 , G01D11/245 , G01P1/026 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/181 , Y10T29/49121 , Y10T29/4921 , H01L2924/00014 , H01L2924/00 , H01L2924/01046 , H01L2924/00012
摘要： The invention relates to a method for manufacturing a sensor, in which a sensor element (100) comprising at least a first housing (7) is at least partially encapsulating in an encapsulation-molding process, whereby a sensor housing is formed by mechanically connecting the sensor element (100) to a support element (200) and/or is held by the support element, whereupon the sensor element and the support element are encapsulated in a common encapsulation-molding process (L) for forming the sensor housing.
摘要翻译： 一种用于制造传感器的方法，其中包括至少第一壳体的传感器元件至少部分地封装在模制密封模制过程中。 作为封装模制工艺的结果，形成传感器外壳。 传感器元件机械地连接到支撑元件和/或由支撑元件容纳，之后传感器元件和支撑元件被密封模塑在用于形成传感器壳体的通用封装模制过程中。
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公开(公告)号：EP3167253B1
公开(公告)日：2019-03-20
申请号：EP15732631.5
申请日：2015-06-25
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公开(公告)号：EP2790890B1
公开(公告)日：2017-03-15
申请号：EP12808750.9
申请日：2012-12-10
发明人： PANIS, Marc , VIERING, Matthias , BIEBRICHER, Lothar , DÉLÉRIS, Robert , APERS, Leon , GRIS, Marie-Noelle , CZEH, Matyas
CPC分类号： B29C45/14336 , B29C45/14065 , B29C45/14639 , B29C45/1671 , B29C2045/14131 , B29C2045/1673 , B29K2995/0005 , B29K2995/0008 , B29L2031/34 , G01D11/245
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公开(公告)号：EP3074730A1
公开(公告)日：2016-10-05
申请号：EP14808561.6
申请日：2014-11-27
发明人： FISCHER, Thomas , BIEBRICHER, Lothar , SCHILLINGER, Jakob , HUBER, Dietmar , SCHULMEISTER, Michael , GÜNTHNER, Stefan
CPC分类号： B29C45/14819 , B29C45/14065 , B29C45/14221 , B29C45/14639 , B29C45/16 , B29C45/1671 , B29C2045/14122 , B29C2045/14131 , B29C2045/14139 , B29K2995/0069 , B29L2031/34 , B29L2031/3481 , G01D11/245
摘要： The invention relates to a method for producing an electronic device (10), the method comprising: encasing an electronic assembly (44) with a first casing material (58); holding the first electronic assembly (44) encased by the first casing material (58) over a holding element (68) such that the holding element (68) is spaced apart from the electronic assembly (44) above the first casing material (58), and encasing the assembly (44) retained on the holding element (68) with a second casing material (62).
摘要翻译： 一种传感器的制造方法，其特征在于，所述传感器被配置为使用测量传感器检测作为要测量的尺寸的物理场，并且经由数据电缆基于检测到的物理场发射电输出信号，所述方法包括： 测量传感器和模具上的数据电缆，定义测量传感器和数据电缆的位置， - 使用第一种材料安装测量传感器和位于模具中的数据电缆， - 拆下测量传感器和数据电缆 从模具中取出第一种材料，并涂覆测量传感器和数据电缆，并从第二种材料上涂覆第一种材料。
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公开(公告)号：EP2504677A1
公开(公告)日：2012-10-03
申请号：EP10788273.0
申请日：2010-11-24
IPC分类号： G01L3/10
CPC分类号： G01L3/101
摘要： The invention relates to a torque sensor comprising a collector module (1) and a sensor module (8), wherein the collector module (1) comprises at least one collector (2, 3) made of magnetically conductive material and wherein the sensor module (8) comprises at least one magnetic field sensor element (11). The sensor module (8) comprises a lead frame (12) electrically contacting the at least one magnetic field sensor element (11) and the lead frame (12) and the at least one magnetic field sensor element (11) are jointly at least partially encapsulated.
摘要翻译： 本发明涉及一种包括收集器模块（1）和传感器模块（8）的转矩传感器，其中收集器模块（1）包括由导磁材料制成的至少一个收集器（2,3），并且其中传感器模块 8）包括至少一个磁场传感器元件（11）。 所述传感器模块（8）包括与所述至少一个磁场传感器元件（11）和所述引线框架（12）电接触的引线框架（12），并且所述至少一个磁场传感器元件（11）至少部分地 封装。
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公开(公告)号：EP3384560B1
公开(公告)日：2020-03-11
申请号：EP16777645.9
申请日：2016-09-29
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公开(公告)号：EP3459325A1
公开(公告)日：2019-03-27
申请号：EP17723679.1
申请日：2017-05-12
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公开(公告)号：EP3342261A1
公开(公告)日：2018-07-04
申请号：EP16751542.8
申请日：2016-08-03
CPC分类号： H05K1/186 , G01R1/203 , G01R19/0092 , H01L21/56 , H01L23/3107 , H01L23/49531 , H01L2224/48265 , H05K3/0014 , H05K2201/10022 , H05K2203/1316 , H05K2203/1327
摘要： The invention relates to a method for covering an electric unit which is covered with two plastic molded bodies. Said invention also relates to an electric component which was been produced by means of said method.
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19.发明授权
公开(公告)号：EP2936074B1
公开(公告)日：2017-05-10
申请号：EP13798670.9
申请日：2013-11-29
IPC分类号： G01D18/00 , G01D11/24 , G01R1/04 , G01R33/09 , H01L23/544 , H05K1/02 , H05K5/00 , H05K5/06 , H05K3/28
CPC分类号： H05K5/0034 , G01D11/245 , G01D18/00 , G01R1/04 , G01R33/09 , H01L23/544 , H01L2223/54433 , H01L2223/54486 , H01L2224/48091 , H01L2224/48137 , H01L2924/1461 , H05K1/0266 , H05K3/284 , H05K5/0017 , H05K5/003 , H05K5/062 , Y10T29/49004 , Y10T29/49147 , H01L2924/00014 , H01L2924/00
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