摘要:
The invention relates to a sensor (14) for sensing a physical transmitter field (32, 38) dependent on a physical quantity (16) to be measured, comprising: a sensor circuit (46) for sensing the transmitter field (32, 38) and for outputting a sensor signal (26, 28) dependent on the transmitter field (32, 38), a circuit carrier (48) having a first region (68) in which at least a part (34) of the sensor circuit (46) is supported and a second region (70) in which at least a first mechanical interface (52) and a second mechanical interface (52) for connecting the circuit carrier (48) to a retainer (56) are arranged, and - a noise resistance element (66), which is arranged between the first region (68) and the second region (70) and which is designed to conduct structure-borne noise (64) entering via the first mechanical interface (52) to the second mechanical interface (52).
摘要:
The invention relates to a method for producing an electronic device (10), the method comprising: encasing an electronic assembly (44) with a first casing material (58); holding the first electronic assembly (44) encased by the first casing material (58) over a holding element (68) such that the holding element (68) is spaced apart from the electronic assembly (44) above the first casing material (58), and encasing the assembly (44) retained on the holding element (68) with a second casing material (62).
摘要:
The invention relates to a sensor, comprising at least one sensor element (1), at least a signal processing element (2), a housing (7), which has at least one attachment means, and an electrical interface for electrically connecting the sensor, wherein the sensor has an electrically and mechanically connecting carrier means (4) on which the at least one sensor element (1) and the signal processing element (2) are arranged and are electrically connected thereto, wherein the carrier means (4) is also at least electrically connected to the electrical interface.
摘要:
The invention relates to an electronic component, comprising a first circuit carrier (1), at least one electronic element (7, 8, 9), which is connected to the first circuit carrier (1), and at least one first housing (3), wherein the electronic component has at least one remaining dam bar structure (6) for fastening.
摘要:
The invention relates to a method for producing an electronic assembly (14) in which an electronic component (26, 30) supported on a wiring support (32) is encapsulated with an encapsulation material (38), the method comprising: - arranging the electronic component (26, 30) on the wiring support (32) in such a manner that a stress applied onto the electronic component (26, 30) by the encapsulation material (38) falls below a predetermined value; and - encapsulating the electronic component (26, 30) with the encapsulation material (38).