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    Double-sided multi-chip circuit component
    11.
    发明公开
    Double-sided multi-chip circuit component 审中-公开
    Doppelseitiges Multi-Chip-Schaltungselement

    公开(公告)号：EP1531494A2

    公开(公告)日：2005-05-18

    申请号：EP04078125.4

    申请日：2004-11-15

    Applicant: Delphi Technologies, Inc.

    Inventor： Campbell, Robert J. ,  Gerbsch, Erich W.

    IPC: H01L25/065

    CPC classification number: H01L25/165 ,  H01L23/492 ,  H01L23/49833 ,  H01L23/49861 ,  H01L25/074 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A multi-chip circuit component comprising first and second substrate members (12,14), each of which are formed of an electrically-nonconductive material. Each substrate member (12,14) has oppositely-disposed first and second surfaces (22,24,46,48), with an outer layer (26,28) of thermally-conductive material on the first surface (22,24) thereof and electrically-conductive areas (36,38,40,42) on the second surface (46,48) thereof. At least two circuit devices (16,18) are present between the first and second substrate members (12,14), with each circuit device (16,18) having a first surface electrically contacting at least one of the electrically-conductive areas (36,38) of the first substrate member (12), and each circuit device (16,18) having a second surface electrically contacting a corresponding one of the electrically-conductive areas (40,42) of the second substrate member (14). First lead members (32,34) are electrically coupled to the electrically-conductive areas (36,38) of the first substrate member (12), and second lead members (30) are electrically coupled to the electrically-conductive areas (40,42) of the second substrate member (14).

    Abstract translation: 一种多芯片电路部件，包括第一和第二基板部件（12,14），每个基板部件由非导电材料形成。 每个衬底构件（12,14）具有相对设置的第一和第二表面（22,24,46,48），在其第一表面（22,24）上具有导热材料的外层（26,28） 和在其第二表面（46,48）上的导电区域（36,38,40,42）。 在第一和第二衬底构件（12,14）之间存在至少两个电路装置（16,18），每个电路装置（16,18）具有电接触至少一个导电区域 第一基板部件（12）的导电区域（40,42）中的相应的一个导电区域（40,42）的每个电路装置（16,18） 。 第一引线构件（32,34）电耦合到第一基板构件（12）的导电区域（36,38），并且第二引线构件（30）电耦合到导电区域（40， 42）。

    Liquid cooled electronics assembly suitable to use electrically conductive coolant
    14.
    发明公开
    Liquid cooled electronics assembly suitable to use electrically conductive coolant 审中-公开
    液体冷却的电子组件，其是适于使用导电的冷却介质的

    公开(公告)号：EP2645839A2

    公开(公告)日：2013-10-02

    申请号：EP13160107.2

    申请日：2013-03-20

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的周边的金属密封件，以形成一个装置组件（10）密封的电介质板，然后 形成器件组件（10）和壳体（18）之间的另一个金属密封件。 该配置允许电子设备（12）和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备（12）从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

    Fluid cooled semiconductor power module having double-sided cooling
    15.
    发明公开
    Fluid cooled semiconductor power module having double-sided cooling 有权
    用双面冷却液体冷却功率半导体模块

    公开(公告)号：EP2034521A3

    公开(公告)日：2011-08-24

    申请号：EP08163192.1

    申请日：2008-08-28

    Applicant: Delphi Technologies, Inc.

    Inventor： Gerbsch, Erich W.

    IPC: H01L25/07 ,  H01L23/473 ,  H01L25/11

    CPC classification number: H01L25/072 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/13055 ,  H01L2924/014 ,  H01L2924/00

    Abstract: A semiconductor power module (10,10') includes one or more semiconductor power devices (70,72) sandwiched between a fluid conducting base (12) and a fluid conducting cover (14a) joined to the base (12). Fluid coolant entering the base (12) diverges into a first flow path through the base (12) and a second parallel flow path through the cover (14a), and then converges and discharges through an outlet (24). The semiconductor devices (70,72) have upper and lower active areas that are thermally coupled to inboard faces of the cover (14a) and base (12) for low double-sided thermal resistance, and the devices (70,72) are electrically accessed through a set of terminals (28,30) formed on the base (12). Multiple sets of semiconductor power devices (70,72) are double-side cooled by joining multiple fluid conducting covers (14a-14f) to the base (12) such that the coolant successively diverges and then re-converges at the locations where each cover (14a-14f) is joined to the base (12). Preferably, the flow paths in both the base (12) and cover (14a) include integral features (50,60) for enhancing the surface area in contact with the coolant.

    Electronic assembly having multiple side cooling and method
    17.
    发明公开
    Electronic assembly having multiple side cooling and method 有权
    与在多个页面上的冷却系统，以及方法的电子设备

    公开(公告)号：EP1781076A2

    公开(公告)日：2007-05-02

    申请号：EP06076881.9

    申请日：2006-10-13

    Applicant: Delphi Technologies, Inc.

    Inventor： Taylor, Ralph S. ,  Jeter, Michael A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

    IPC: H05K7/20

    CPC classification number: H05K7/20872 ,  H05K1/182 ,  H05K7/20927

    Abstract: An electronics assembly (10) is provided having a substrate (12) and at least one electronics package (20) supported on the substrate (12). The electronics package (20) also has electrical circuitry and first and second side surfaces. The assembly (10) further includes a first heat sink device (30) positioned in thermal communication with the first side surface of the electronics package (20), and a second heat sink device (40) positioned in thermal communication with the second side surface of the electronics package (20).

    Abstract translation: 电子组件（10）的基材，提供具有支撑在（12）一个基片（12）和至少一个电子器件封装（20）。 电子封装件（20），因此具有电路和第一和第二侧表面。 该组件（10）还包括在热连通并位于与电子器件封装（20）的第一侧面上的第一散热器装置（30），和在热连通并位于与所述第二侧表面的第二散热装置（40） 的电子封装件（20）。

    Automotive electronics heat exchanger
    18.
    发明公开
    Automotive electronics heat exchanger 审中-公开
    WärmertauscherfürKraftfahrzeugelektronik

    公开(公告)号：EP1377148A2

    公开(公告)日：2004-01-02

    申请号：EP03076656.2

    申请日：2003-05-28

    Applicant: Delphi Technologies, Inc.

    Inventor： Jeter, Michael A. ,  Mock, Roger A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

    IPC: H05K7/20

    CPC classification number: H05K7/20927 ,  F28D2021/0029 ,  F28F3/027 ,  F28F3/12

    Abstract: An electronics assembly 10 is provided, including a housing 12 and at least one electronic power device 18 positioned within. A heat sink device 34 is positioned within the housing 12 and is in thermal communication with the electronic power device 18. The heat sink device 34 includes a fluid vessel 44, a fluid input port 50, a fluid output port 52, and at least one fin insert 60 brazed into the fluid vessel 44. The heat sink device 34 is in fluid communication with an automotive radiator 46 such that coolant 48 flows from the automotive radiator 46 through the fluid vessel 44 thereby cooling the electronic power device 18.

    Abstract translation: 提供电子组件10，其包括壳体12和位于其内的至少一个电子功率器件18。 散热装置34定位在壳体12内并与电子功率装置18热连通。散热装置34包括流体容器44，流体输入端口50，流体输出端口52和至少一个 翅片插入件60钎焊到流体容器44中。散热装置34与汽车散热器46流体连通，使得冷却剂48从汽车散热器46流过流体容器44，从而冷却电子电力装置18.

    Liquid cooled electronics assembly suitable to use electrically conductive coolant
    19.
    发明授权
    Liquid cooled electronics assembly suitable to use electrically conductive coolant 有权

    公开(公告)号：EP2645839B1

    公开(公告)日：2018-09-12

    申请号：EP13160107.2

    申请日：2013-03-20

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

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