摘要:
A sense amplifier circuit comprising of one or two differential amplifiers to each of which are connected one or two reference transistors (Q 15 , Q' 15 resp. Q 25 , Q' 25 ) for producing the reference voltages (V' R i resp. V' R2 ) of the corresponding differential amplifiers. The reference transistors are controlled by input signals (e.g. V i1 ) and/or output signals (e.g. V 02 ) of the differential amplifiers.
摘要:
A static-type RAM device in which the amplitude of the data signal stored in a memory cell just after the writing in of data is completed is increased and the stability of the data stored in each memory cell is increased. The RAM device comprises a bit-line pufling-up means for pulling up the potential of a bit line to a voltage which is approximately equal to or larger than the power supply voltage and a word-line pulling-up means for pulling up the potential of a selected word line to a voltage which is larger than the power supply voltage after the writing in of data is completed.
摘要:
A semiconductor resistor element comprising a semiconductor film (14) which has a desired shape and electrode wirings (20a-20b) at both ends thereof, and a control electrode (18) provided between the two ends of the semiconductor film (14) via an insulating film (16). The control electrode (18) is served with a control voltage which controls the resistance of the semiconductor film. Namely, the control electrode is served with a control voltage that changes with the change in temperature to offset the change in resistance of the semiconductor film caused by the change in temperature.
摘要:
in a semiconductor device including a connection structure comprising a first conductive layer 14 formed in or on a semiconductor substrate 11, a second conductive layer 15 arranged adjacent the first conductive layer 14, and a third conductive layer 17 connecting the first conductive layer 14, and to the second conductive layer 15. The third conductive layer 17 is in contact with the first 14 and second 15 conductive layers in a contact region 16'. One dimension of the portion of the second conductive layer 15 in the contact region 16' varies which enables the size of the contact region 16' to be reduced whilst still ensuring a positive connection between the first 14 and second 15, conductive layers even in the event of their misregistry.
摘要:
A static-type semiconductor memory device having a three-layer structure; the gate-electrode wiring lines being formed by a first conductive layer of, for example, polycrystalline silicon; the word lines, the ground lines, and the power supply lines being formed by a second conductive layer of, for example, aluminum; and the bit lines being formed by a third conductive layer of, for example, aluminum; the bit lines extending in a column direction, and the ground lines extending in a row direction; whereby an improved integration degree, an improved operating speed, an improved manufacturing yield, and a countermeasure for soft errors due to alpha particles are attained.
摘要:
A logic circuit comprises a plurality of input terminals (IN 1 , IN 2 ,...), an output terminal (OUT), a load (L), and at least two driver circuits (D 1 , D 2 ,...). Each of the driver circuits (D 1 , D 2 ....) comprises a plurality of gates (Q l1 , Q l2 ,...) connected in series, each gate being driven by the potential at one of the input terminals (IN 1 , IN 2 ,...). In addition, first gates (Q 11 , Q 22 ,...) of the driver circuits (D 1 , D 2 ,...) connected directly to the output terminal (OUT) are driven by the potentials at different input terminals. With this arrangement at least one of the driver circuits (D 1 , D 2 ,...) operates rapidly in response to changes of input signals so as to change the potential at the output terminal (OUT). As a result, no fluctuation in operation speed is generated under any conditions of input signals, and, in addition, the operation speed is increased.
摘要:
n a buffer circuit comprising a first, a second and a third transistor (31, 32, 33) and a capacitor (4) for bootstrap action, an inverter (52) is connected to the output point (6) at which the second and third transistors are connected in series, the inverter inverting the output signal (Sout) and supplying the inverted signal (S52) to the gate of the first transistor (31), thereby to increase the rate of rise of the leading edge of an output signal pulse.
摘要:
A semiconductor memory device has memory cells 2 and decoder circuitry 3 disposed centrally thereof. A ground line 7' extends around the memory cells 2 and the decoder circuitry 3. Control circuits 41 to 46 are disposed beneath or outwardly of the ground line 7'. Signal lines 5' for connecting the control circuits to one another are disposed outwardly of the control circuits41 to46. A power line 6' is inturn disposed outwardly of the signal lines 5'. This layout can provide for a reduction in the number of bridges required.