Semiconductor device and method for fabricating the same
    12.
    发明公开
    Semiconductor device and method for fabricating the same 有权
    Halbleiterlaservorrichtung und Herstellungsverfahren

    公开(公告)号:EP0997996A2

    公开(公告)日:2000-05-03

    申请号:EP99120838.0

    申请日:1999-10-25

    IPC分类号: H01S5/323 H01L33/00

    摘要: A semiconductor device includes a substrate, a multi-layer structure provided on the substrate, a first-conductive-type etch stop layer of a III nitride provided on the multi-layer structure, and a second-conductive-type first semiconductor layer of a III nitride provided on the etch stop layer. A molar fraction of Al is lower in a composition of the III nitride included in the first semiconductor layer than in a composition of the III nitride included in the etch stop layer.

    摘要翻译: 半导体器件包括衬底,设置在衬底上的多层结构,设置在多层结构上的III族氮化物的第一导电型蚀刻停止层和第二导电型第一半导体层, 提供在蚀刻停止层上的III族氮化物。 包含在第一半导体层中的III族氮化物的组成中Al的摩尔分数低于蚀刻停止层中包含的III族氮化物的组成。