Nitride semiconductor laser device
    7.
    发明公开
    Nitride semiconductor laser device 有权
    Halbleiterlaser aus einer Nitridverbindung

    公开(公告)号:EP0949731A3

    公开(公告)日:2000-01-26

    申请号:EP99106798.4

    申请日:1999-04-06

    IPC分类号: H01S3/19 H01S3/025

    摘要: The nitride semiconductor laser device of the present invention includes: a nitride semiconductor laser diode (100); and a protective layer (20a,20b) formed on at least one facet of the nitride semiconductor laser diode. The protective layer is made of Al 1-x-y-z Ga x In y B z N (where 0≦x, y, z≦1 and 0≦x+y+z≦1), which is transparent to light emitted from the laser diode (100).

    摘要翻译: 本发明的氮化物半导体激光器件包括:氮化物半导体激光二极管(100); 以及形成在所述氮化物半导体激光二极管的至少一个面上的保护层(20a,20b)。 保护层由Al1-xy-zGaxInyBzN(其中0

    Method for producing a group III nitride compound semiconductor substrate
    9.
    发明公开
    Method for producing a group III nitride compound semiconductor substrate 有权
    格雷普三世 - 西伯利亚革命

    公开(公告)号:EP1045431A1

    公开(公告)日:2000-10-18

    申请号:EP00107908.6

    申请日:2000-04-13

    IPC分类号: H01L21/20 H01L33/00 H01L31/18

    摘要: The present invention provides a method for producing a group III nitride compound semiconductor substrate including: (a) forming a first semiconductor film over a substrate, the first semiconductor film made of a first group III nitride compound semiconductor and provided with a step; (b) forming a second semiconductor film made of a second group III nitride compound semiconductor having a different thermal expansion coefficient from that of the first group III nitride compound semiconductor on the first semiconductor film; and (c) cooling the substrate and separating the second semiconductor film from the first semiconductor film. Thus, a large-area group III nitride compound semiconductor substrate can be produced in high yields and with high reproducibility.

    摘要翻译: 本发明提供一种III族氮化物化合物半导体衬底的制造方法,包括:(a)在衬底上形成第一半导体膜,所述第一半导体膜由第一III族氮化物化合物半导体制成,并具有步骤; (b)形成由第一半导体膜上的第一III族氮化物半导体的热膨胀系数不同的第二III族氮化物化合物半导体制成的第二半导体膜; 和(c)冷却基板并将第二半导体膜与第一半导体膜分离。 因此,可以以高产率和高重现性制造大面积III族氮化物化合物半导体衬底。