公开(公告)号：EP1124770A1

公开(公告)日：2001-08-22

申请号：EP99951480.5

申请日：1999-10-08

申请人： PPG Industries Ohio, Inc.

发明人： NOVICH, Bruce, E. ,  ROBERTSON, Walter, J. ,  VELPARI, Vedagiri ,  LAMMON-HILINSKI, Kami ,  LAWTON, Ernest, L.

IPC分类号： C03C25/10 ,  C08J5/08 ,  H05K1/03

CPC分类号： C08J5/08 ,  C03C25/47 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

摘要： One aspect of the present invention is a prepreg for an electronic support, the prepreg comprising: (a) a polymeric matrix material; and (b) a fabric comprising a strand comprising glass fibers, at least a portion of the fabric having a coating which is compatible with the polymeric matrix material, the prepreg having a drill tip percent wear of no greater than about 32 percent, as determined after drilling 2000 holes through a stack of 3 laminates, each laminate including eight of the prepregs, at a hole density of 62 holes per square centimeter (400 holes per square inch) and a chip load of 0.001 with a 0.46 mm (0.018 inch) diameter tungsten carbide drill. The present invention also provides a laminate incorporating the prepreg. Another aspect of the present invention is a prepreg for an electronic support, the prepreg comprising: (a) a polymeric matrix material; and (b) a woven reinforcement fabric comprising glass fibers, at least a portion of the fabric having a coating which is compatible with the polymeric matrix material, the prepreg having a deviation distance of no greater than about 36 micrometers, as determined after drilling 2000 holes through a stack of 3 laminates at a hole density of 62 holes per square centimeter (400 holes per square inch) and a chip load of 0.001 with a 0.46 mm (0.018 inch) diameter tungsten carbide drill. The present invention also provides a laminate incorporating the prepreg.